Processing Chamber Pressure Estimation Using Exit Flow Conductance
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Solution Overview
Problem
In substrate manufacturing, accurately determining pressure at a substrate during processing is challenging due to the distance between vacuum sources and processing chambers, leading to non-uniform pressure levels and inconsistencies in substrate processing quality.
Innovation Solution
A method and system that use a prediction engine to generate model-driven pressure estimates by processing measurements of pressure values at the terminal end of an exit flow path from a processing chamber, using a model comprising conductance values for segments of the exit flow path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a sensor is placed at or near the vacuum pump to regulate vacuum pressure, then the vacuum pump can be regulated effectively, but the pressure measured away from the processed substrate varies from the pressure at the substrate
Solution Approach 1:
The patent introduces a computational model as an intermediary between the pressure sensor and the substrate. The model uses conductance values of flow path segments to translate the pressure measurement taken at the pump into an accurate estimate of pressure at the substrate, eliminating the need for direct physical contact between sensor and substrate while maintaining measurement precision
Solution Approach 2:
The patent replaces the mechanical approach of placing a physical sensor near the substrate with a computational system. Instead of using a second physical sensor in the chamber, the system uses mathematical modeling and conductance calculations to determine substrate pressure from remote measurements, reducing hardware complexity and potential contamination risks
2Adaptability or versatility
If the vacuum source is located at a considerable distance from the processing chamber, then system layout flexibility is improved, but pressure uniformity within the chamber deteriorates
Solution Approach 1:
The patent changes the parameter being measured and modeled - instead of directly controlling and measuring pressure uniformly throughout the system, it models the pressure distribution as a function of position and conductance. This allows the system to accommodate distance and layout flexibility while maintaining awareness of pressure uniformity through computational correction
Solution Approach 2:
The patent adds a computational dimension to the physical system. By introducing a model that calculates pressure at multiple points based on conductance values and measured pressure, the system transforms a single-point measurement into a multi-dimensional pressure map, enabling remote vacuum source placement without sacrificing pressure uniformity control
3Measurement precision
If multiple sensors are placed throughout the system to accurately measure pressure at all locations, then pressure measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent creates a virtual copy of the pressure field through computational modeling. Instead of placing physical sensors throughout the system, the model generates virtual pressure measurements at multiple locations based on conductance calculations, providing comprehensive pressure information with a single physical sensor
Solution Approach 2:
The patent makes a single pressure sensor perform multiple measurement functions through the computational model. The model uses the single sensor reading combined with conductance data to determine pressure at multiple locations simultaneously, making the sensor system universal rather than requiring dedicated sensors for each measurement point
Data Source
AI summary
A method for estimating pressure values within a processing chamber is provided. The method can include receiving a measurement of a pressure at a terminal end of an exit flow path from a processing chamber, and processing the measurement of the pressure using a model including conductance values for a plurality of segments of the exit flow path to estimate one or more pressure values within the processing chamber.