Chamfered Disk Glass Substrate for Uniform Grinding

The patent applies preliminary action by performing chamfering processing on the glass blank before grinding and polishing. This preliminary chamfering removes corner portions and creates inclined surfaces, which prevents concentration of frictional forces during subsequent processing. The glass blank is prepared in advance with modified geometry to ensure uniform frictional force distribution during thinning operations, thereby enabling stable mass production of thin glass substrates with high surface quality.

The patent applies local quality by modifying specific regions of the glass blank through chamfering. The corner portions and edge regions are selectively removed or modified to create inclined surfaces, while the central area remains intact for subsequent substrate production. This localized geometric modification ensures that frictional forces are uniformly distributed across the processing surfaces during grinding and polishing, enabling precise thinning of large glass blanks.

The patent applies preliminary action by performing chamfering processing on corner portions before main substrate processing. The corner portions are removed or modified to create inclined surfaces, eliminating the geometric features that would cause non-uniform frictional force concentration. This preliminary modification enables subsequent grinding and polishing to proceed with uniform frictional force distribution, achieving high surface quality even in regions that will become corner areas of rectangular substrates.

The patent applies preliminary action by performing chamfering processing to create inclined surfaces at corner portions and edges before thinning operations. These chamfered surfaces act as stress-relief features that prevent crack initiation and propagation during subsequent handling and transfer operations. The preliminary geometric modification strengthens the glass blank against mechanical damage, enabling efficient production while maintaining high reliability and reducing substrate breakage during handling.