Edge Grinding Machines TRIZ Cases

A lens edging system corrects calculation parameters using measured circumferential length data to maintain precise outer shape dimensions.

A multi-tool aggregate unit drives progressively finer polishing tools via a single rotating shaft to finish stone plate edges.

A substrate production apparatus uses a common buffer unit to store and transfer model substrates between parallel processing lines.

RFID elements on blocking accessories automate lens identification, eliminating manual barcode errors and reducing processing time.

Counter-rotating abrasive wheels with chamfered edges cancel kickback forces while a gear-driven motor delivers sufficient torque for efficient sharpening.

Magnetic retention in this deburring brush allows simultaneous bristle unit removal, eliminating time-consuming manual screwdriver work.

A polishing apparatus uses a protector with an opening to supply liquid to the peripheral edge of a semiconductor wafer.

Segmented abrasive working with two tool diameters removes raised portions efficiently, reducing processing time by a quarter compared to single-tool methods.

A grinding device uses interchangeable guide inserts to adapt a single housing opening for various welding electrode diameters.

A lapping machine uses a measuring tool and conditioning tool to correct the finishing surface contour.

Rounding the support edge and applying an epoxy coating eliminates glass fiber scratches, reducing defect rates from 37% to 2% on 300 mm wafers.

Staged material reduction forms arcuate transition surfaces with varying curvature radii to enhance display screen manufacturing precision.

A multi-holder fixture rotates and translates cannulas simultaneously during grinding operations.

Laser processing creates internal cracks in silicon carbide wafers, eliminating mechanical waste and boosting cutting speed.

A tungsten chemical mechanical polishing slurry uses polyethoxylated tallow amine to inhibit corrosion during substrate processing.

Inverted abrasive disc trims tile edges while a support plate slides on the bonding side, preventing outer surface damage during bevelling.

A chemical mechanical polishing system uses a docking unit to supply air pressure to a rotary union on a moving substrate carrier.

An elongation jig prevents cross-sectional area increase at the outlet, ensuring uniform fluid polishing across complex internal surfaces.

Cooling pipe with coolant inside polishing wheel chamber reduces surface temperature, preventing thermal damage and extending service life.

Oscillating a grinding wheel and workpiece intermittently separates them during traversal.

Helical ridge on rotating wheel automates scissor blade resharpening, eliminating tedious manual filing and reducing process time.

Removable crosspiece segments adjust the frame width to clean varying roller lengths, eliminating multiple specialized units.

Chamfering disk glass blanks eliminates corner friction concentration during double-side processing, ensuring uniform thickness and high surface quality.

An intelligent polishing system uses electronic sensors to monitor pressure, speed, and time during surface treatment.

Stirring metal articles with curved media in a barrel device applies residual stress and reduces surface roughness.

A polishing apparatus identifies wafer bevel shapes before processing to select optimal conditions.

A machine captures two-dimensional images of optical lenses from different angles to determine three-dimensional data for precise trimming.

A high viscosity polyoxyalkylene glycol coolant composition reduces grinding energy and substrate damage during glass processing.

Mechanical reference system on lens blanks allows accurate electronic component embedding without post-edging calibration or visual detection.

A polishing pad with controlled surface resistivity holds aqueous dispersion for uniform material removal.

Segmented brush rings rotate at different speeds to maintain high linear velocity, removing corner burrs from wheel flanges and rims effectively.

Segmented masking tool prevents edge damage and contamination during polishing, achieving ultra-fine surface roughness below 5 micro-inches.

A single processing head uses switchable scrubbing tapes to polish and clean wafer surfaces without transferring the substrate between units.

Diagonally positioned rotating tools apply balanced forces to prevent downstream pushing and cracking during powder compact edge processing.

Multiple ultrasonic vibration sources generate multi-directional abrasive flow to process complex surfaces that single-motor grinders cannot reach.

Press machining austenitic stainless steel creates durable door levers that resist saltwater corrosion in coastal environments.

A lens blank with a surface recess spans a cover film to create a gripping zone, eliminating manual scratches and fluttering noise during automated processing.

Acidic aqueous composition with complex fluorides promotes adhesion on aluminum, magnesium, and zinc surfaces while avoiding phosphate sludge formation.

Rotating a cylindrical tank with sliding abrasive motion reduces surface roughness below 0.2 micrometers while preventing material tumbling.

Image processing calculates precise drill hole position and dimensions to correct errors caused by presentation lens curvature.

A sander machine uses a control unit to move an abutment roller along a Z-axis for precise surface finishing.

A detachable motor flange sleeve allows rapid housing replacement to resolve repair complexity and adaptability constraints in electrode grinding.

A surface grinding apparatus uses a movable bridge to trim wafer edges and grind surfaces on dual spindles.

Integrally formed fan blades direct airflow over the abrasive surface, reducing workpiece temperature by 8-10% while eliminating separate clamping hardware.

A sensor unit detects suction hose connection and flap position to control cutting wheel rotation direction.

Disposable abrasive films replace expensive blades to reduce costs while maintaining cleaving quality.

A face-up polishing apparatus uses an annular pad to target substrate edges with lateral translation and rotation.

Belt grinding apparatus automates welded member smoothing, replacing manual labor to reduce process time and ensure consistent surface quality.

Servo-controlled grinding heads remove burrs from wheel flanges and valve holes, eliminating manual labor and reducing processing time.

Cylindrical fluid jets and reciprocating nozzles remove protective films without adhesive remnants, eliminating thermal energy loss.