Wafer Support Member Edge Coating for Scratch Prevention

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Solution Overview

Problem

Conventional wafer support members in semiconductor fabrication cause fine scratches on the wafer surface due to glass fibers and foreign materials during polishing, leading to surface damage and defects.

Innovation Solution

A wafer support member with a base substrate and a support layer laminated at the edge, featuring a rounded outermost part and an epoxy-polymer coating layer applied to the edge, which is thicker and wider than the support, to prevent damage and scratches during polishing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional wafer support member with laminated epoxy glass is used, then the wafer is retained and guided during polishing, but fine scratches and surface defects are generated on the wafer surface

Engineering Contradiction:

Improvewafer retentionVSAvoidsurface scratches

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The harmful glass fibers and foreign materials from the edge of the support member are removed by rounding the edge, extracting the source of scratches while maintaining the support function

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

A coating layer is introduced as an intermediary between the support member edge and the wafer surface, providing a smooth interface that prevents direct contact between rough edges and the wafer, thereby eliminating scratches

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the edge of the support member is rounded, then scratches are reduced, but the structural strength may be compromised

Engineering Contradiction:

Improvesurface scratchesVSAvoidedge strength

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The support member is constructed as a composite structure with a base substrate and a coating layer, where the coating layer provides surface smoothness and scratch prevention while the base substrate maintains structural strength

Inventive Principle:

Principle #40Composite materials

3Manufacturing precision

If a coating layer is applied to the edge, then wafer separation is prevented and surface quality is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvesurface finish qualityVSAvoidmanufacturing process

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The coating layer parameters (thickness, material composition, curing conditions) are optimized to achieve the desired surface quality while minimizing manufacturing complexity and cost

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces scratches and surface defects, achieving a mirror finish with a defect percentage decrease from >37% to about 2% for a 300 mm wafer, enhancing the polishing process by preventing wafer separation and foreign material interference.

Implementation Method 1

a coating layer provided on the outermost edge of the support

Methodology Applied

Scientific EffectPhysical barrier:

Implementation Method 2

a support adhered at a predetermined width to the edge of the base substrate

Methodology Applied

Scientific EffectLamination: Lamination

Data Source

PatentUS8574033B2Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same

Publication Date: 2013.11.05 LG SILTRON

AI summary

Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.