Polishing Wheel Cooling Pipe for Glass Substrate Temperature Control
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Solution Overview
Problem
Existing polishing machines for glass substrates experience high temperatures during the polishing process, which affects the service life of the polishing wheel and the yield of the glass substrate due to friction between the polishing wheel and the glass.
Innovation Solution
A polishing device with a cooling pipe containing a coolant is integrated into the chamber of the polishing wheel, allowing for heat conduction and dissipation, and a vacuum suction system to collect glass scraps, ensuring the glass substrate remains below a preset temperature to prevent melting and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a motor drives the polishing wheel to rotate for polishing the glass substrate, then the polishing function is achieved, but the temperature of the polishing wheel and glass substrate increases during friction
Solution Approach 1:
A cooling pipe containing coolant is introduced as an intermediary element between the polishing wheel and the environment. The cooling pipe penetrates through the polishing wheel, allowing coolant to flow through and absorb heat generated during polishing, thereby mediating the thermal interaction and preventing excessive temperature rise.
Solution Approach 2:
The patent replaces part of the mechanical polishing system with a thermal management system. Instead of relying solely on mechanical friction for polishing, a cooling system with coolant circulation is integrated to substitute the harmful thermal effect while maintaining the necessary mechanical polishing action.
2Productivity
If the polishing wheel rotates at high speed for efficient polishing, then productivity increases, but the temperature rise accelerates and affects service life and yield
Solution Approach 1:
The cooling pipe with coolant acts as a thermal intermediary that can handle high-speed polishing conditions. The coolant circulation system provides continuous heat removal capability that scales with polishing intensity, allowing high productivity while maintaining temperature control.
3Device complexity
If no cooling system is used, then the device complexity is low, but the temperature increase reduces service life and yield
Solution Approach 1:
The cooling pipe is designed as a relatively simple intermediary component that can be integrated into the existing polishing wheel structure. This minimalistic cooling approach provides effective temperature control without significantly increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling system effectively reduces the polishing temperature, extending the service life of the polishing wheel and improving the yield of the glass substrate by preventing thermal damage and water contamination, while the vacuum system enhances precision and cleanliness.
Implementation Method 1
the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make a temperature of the outer peripheral polishing surface of the polishing wheel and a temperature of the predetermined polishing surface of the glass substrate during a polishing process is lower than a preset temperature
Implementation Method 2
the coolant flowing through the cooling pipe realizes that the heat conducted to the cooling pipe is taken away and is conducted to the outside
Implementation Method 3
the vacuum suction pipe and the vacuum suction hole are connected to the vacuum device, and the vacuum device is configured to vacuum the vacuum suction pipe so as to collect the glass scraps in the collection device through the vacuum suction pipe and configured to suck the glass substrate on the platform through the vacuum suction hole
Data Source
AI summary
A polishing device configured to polish a glass substrate is disclosed, including a polishing wheel fixedly arranged, a cooling pipe, and a movable platform. The polishing wheel has an outer peripheral polishing surface, the glass substrate is placed on the platform and is driven by the platform to move so as to make the outer peripheral polishing surface polish the predetermined polishing surface of the glass substrate; the polishing wheel further has a chamber, and the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make temperatures of the outer peripheral polishing surface and the predetermined polishing surface during polishing is lower than a preset temperature. The disclosure solves the problem of high polishing temperature of the polishing wheel and the glass substrate, thereby enhancing the service life of the polishing wheel and the yield of the glass substrate.