Charge Pump Output Voltage via Package Wiring
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Solution Overview
Problem
Existing charge pump designs require modification of internal circuit layout and multiple verification procedures to accommodate different output voltages, leading to increased costs and inefficiencies when used in various electronic devices.
Innovation Solution
A charge pump design that allows for changing the output voltage by modifying the wiring configuration on the package substrate, while maintaining the original internal circuit layout, allowing the chip and package substrate to be verified only once for multiple applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the internal circuit layout of the chip is modified to generate different output voltages, then the charge pump can provide different working voltages for different electronic apparatuses, but the verification procedure must be repeated and costs increase
Solution Approach 1:
The patent segments the charge pump circuit into two independent parts: the chip (containing transistors M1-M9 and clock generator) and the package substrate (containing external pins and wiring). By separating the functional circuit from the connection interface, the chip can be verified once and reused across multiple applications with different wiring configurations on the substrate, eliminating repeated verification needs.
Solution Approach 2:
The patent makes the package substrate wiring dynamic and reconfigurable. Different external pin connections can be established on the package substrate to achieve different output voltages (e.g., connecting different numbers of capacitors in series) without modifying the fixed chip internal circuit. This dynamic reconfiguration allows adaptability while keeping the verified chip design unchanged.
2Adaptability or versatility
If multiple chips of different specifications are prepared to meet different output voltage requirements, then different working voltages can be provided, but the verification procedure and operating time increase
Solution Approach 1:
The patent creates a universal chip design that can serve multiple functions and applications. The chip with its fixed internal circuit (transistors M1-M9 and clock generator) is designed to work with different package substrate configurations. This single universal chip can provide multiple output voltages by changing the external wiring on the package substrate, eliminating the need for multiple specialized chips and reducing verification time.
3Adaptability or versatility
If the wiring of the package substrate is modified to change output voltage, then different working voltages can be achieved, but the circuit layout must be changed
Solution Approach 1:
The patent segments the overall system into the chip (fixed internal layout) and package substrate (flexible wiring). This segmentation allows the manufacturing of the chip to remain simple and unchanged, while all wiring modifications for different output voltages are confined to the package substrate level, which is easier to reconfigure and manufacture in different configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the generation of different output voltages without altering the internal circuit design, reducing verification costs and simplifying the process for using the charge pump in various electronic devices.
Implementation Method 1
the 1st capacitor C1 is charged to the voltage level of VDD−Vt... the 2nd capacitor C2 is charged to 2×(VDD−Vt)... the voltages of capacitors C3 ̃C8 can be regulated
Implementation Method 2
the odd number transistors M1, M3, M5, M7 and M9 are conducted... the even number transistors M2, M4, M6 and M8 are cut off
Data Source
AI summary
A charge pump includes a chip and a package substrate packaged on the chip and installed in a circuit board. One of the 1st˜(X−Y)th external pins of the package substrate is electrically connected to the (X−Y)th input pin of the chip, and the other end of the same external pin is electrically connected to the input voltage of the circuit board. Thus, when the input voltage is being boosted through each capacitor of the circuit board, it is free from the action of the 1st through (X−Y−1)th transistors of the chip and therefore the original design of the 1st through (X−Y−1)th transistors can be maintained without causing any change in the output voltage Thus, the invention eliminates the problem of the prior art design that needs to change the internal circuit design when a different output voltage is required.