Electronic Device Chassis Thickness Reduction via FPC and Fan Repositioning
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Solution Overview
Problem
Conventional electronic devices face challenges in reducing chassis thickness and optimizing the layout of components due to the large size of expansion cards like M.2 SSDs and WWANs, which limits the compactness and efficiency of the internal structure.
Innovation Solution
The electronic device employs a flexible printed circuit (FPC) to connect the substrate and expansion cards, with a cooling fan positioned between the substrate and expansion cards, and a bracket system that allows for flexible placement and fixation of components within the chassis, reducing thickness and enhancing layout flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If expansion cards conforming to M.2 standards are connected to a connector disposed on the substrate, then the electronic device can support high-capacity storage and wireless communication, but the thickness of the chassis cannot be reduced and the layout of members in the chassis is limited
Solution Approach 1:
The patent repositions the cooling fan from a traditional side-mounted location to a space above the substrate, utilizing the vertical dimension (thickness direction) for component placement. This dimensional transition allows the fan to be positioned in previously unused space, enabling reduced chassis thickness while maintaining cooling functionality and accommodating expansion cards.
2Adaptability or versatility
If expansion cards having a large outer shape are connected to the substrate, then the device functionality is enhanced, but the layout of members in the chassis is likely to be limited
Solution Approach 1:
The patent segments the internal space by positioning the cooling fan above the substrate rather than alongside expansion cards. This spatial segmentation creates independent zones that allow expansion cards to be freely arranged in the lateral direction without being constrained by cooling component placement, thereby simplifying the overall layout while maintaining enhanced device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a more compact and efficient internal layout, improving cooling efficiency and reducing the weight and thickness of the device while allowing for stable fixation and easy assembly of components.
Implementation Method 1
a cooling fan cooling the heat transport member
Implementation Method 2
a cooling unit having a heat transport member thermally connected to the electronic component
Data Source
AI summary
An electronic device is provided with a substrate mounted with an electronic component, an expansion card disposed at an interval from the substrate, a flexible printed circuit electrically connecting the substrate and the expansion card, a connector which is provided in the flexible printed circuit and to which a terminal of the expansion card is connected, a cooling unit having a heat transport member thermally connected to the electronic component and a cooling fan cooling the heat transport member, a bracket fixed to the connector, and a chassis housing the substrate, the expansion card, the flexible printed circuit, the connector, the cooling unit, and the bracket, in which the cooling fan is disposed between the substrate and the expansion card and overlaps with the flexible printed circuit in the plan view and the bracket is fixed to the chassis.