Chip Bonding Tool Cavity Structure for Uniform Thermocompression Heating
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Solution Overview
Problem
In the process of thermocompression bonding of flip chip-type semiconductor chips, uneven heating can lead to deformation and bonding failures due to heat conduction imbalances from the bonding tool.
Innovation Solution
A chip bonding apparatus with a bonding tool featuring a cavity and a partition wall structure that prevents direct heat transfer to the central region, ensuring uniform heat distribution and pressure application across the semiconductor chip, using a heater to cover the cavity and a bonding head to transmit pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is conducted from the heater to the semiconductor chip through the bonding tool, then the bonding process can be performed, but the semiconductor chip may be unevenly heated resulting in deformation or bonding failure
Solution Approach 1:
The bonding tool is divided into multiple heating zones with independent temperature control. The heating surface includes a first heating region and a second heating region that can be controlled at different temperatures, allowing differential heating to compensate for heat loss to the substrate and achieve uniform temperature distribution across the semiconductor chip.
Solution Approach 2:
Different regions of the bonding tool's heating surface are assigned different thermal properties. The first heating region (central area) operates at a higher temperature to compensate for greater heat loss to the substrate, while the second heating region (peripheral area) operates at a lower temperature, creating a non-uniform temperature distribution in the bonding tool that results in uniform temperature in the semiconductor chip.
2Use of energy by moving object
If the bonding tool directly contacts the semiconductor chip for heating, then heating efficiency is improved, but heat distribution becomes uneven causing chip deformation
Solution Approach 1:
The heating surface of the bonding tool is segmented into multiple independent heating regions with separate temperature control. This allows the system to maintain high overall heating efficiency while creating specific temperature gradients across different areas to prevent chip deformation.
Solution Approach 2:
The temperature parameter is varied across different regions of the bonding tool's heating surface. By adjusting the temperature of each heating region independently, the system optimizes both heating efficiency and temperature uniformity in the semiconductor chip, preventing deformation while maintaining efficient heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces temperature deviations between the central and peripheral regions of the semiconductor chip, minimizing deformation and bonding defects, and optimizing energy consumption in the thermocompression bonding process.
Implementation Method 1
heat is conducted from the heater to the semiconductor chip through the bonding tool
Implementation Method 2
a method of thermal compression bonding is used... heating a semiconductor chip with a heater while pressing the semiconductor chip with a bonding tool
Data Source
AI summary
A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.