Semiconductor Chip Bonding With Adhesive-Embedded Contact Pads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor bonding technologies face challenges in efficiently bonding multiple semiconductor chips due to issues such as discontinuity of bonding, void generation, and formation of metal oxide layers, which hinder effective electrical connectivity and increase the likelihood of defects.
Innovation Solution
A semiconductor device design involving a first and second semiconductor chip with dielectric layers and adhesive layers made of organic dielectric materials, where conductive pads penetrate and extend into the adhesive layer, allowing for direct contact and forming a connection pad, accompanied by a reforming process to enhance adhesion and minimize voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding technologies are used to bond multiple semiconductor chips, then bonding can be achieved, but discontinuity of bonding and void generation occur which hinder electrical connectivity and increase defects
Solution Approach 1:
An adhesive layer is introduced as an intermediary material between the first and second dielectric layers to facilitate bonding between semiconductor chips. This adhesive layer prevents direct contact between dielectric layers, eliminating void formation while ensuring continuous bonding and electrical connectivity through the conductive pads that extend into the adhesive layer.
2Reliability
If conventional bonding methods are used, then semiconductor chips can be bonded, but metal oxide layers form which hinder electrical connectivity
Solution Approach 1:
The adhesive layer serves as a protective intermediary that prevents metal oxide layer formation on the conductive pads during the bonding process. By extending the conductive pads into the adhesive layer rather than allowing them to directly contact the dielectric layers, the invention ensures maintained electrical connectivity without oxidation.
3Adaptability or versatility
If multiple semiconductor chips are bonded using existing technologies, then integration is achieved, but the bonding process is complex and defect-prone
Solution Approach 1:
Conductive pads are pre-formed on the semiconductor chips before bonding, and the adhesive layer is prepared in advance. This preliminary preparation simplifies the bonding process by eliminating the need for complex real-time alignment and connection formation, reducing defects while enabling multi-chip integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and efficient bonding of semiconductor chips with reduced defects, ensuring continuous electrical connectivity and minimizing voids, thereby improving the reliability and performance of the semiconductor device.
Implementation Method 1
an adhesive layer between the first dielectric layer and the second dielectric layer, where the adhesive layer includes an organic dielectric material
Data Source
AI summary
A semiconductor device includes a first semiconductor chip having a first surface and a second surface that is opposite to the first surface, a second semiconductor chip having a third surface facing the first surface and a fourth surface that is opposite to the third surface, a first dielectric layer on the first surface of the first semiconductor chip, a second dielectric layer on the third surface of the second semiconductor chip, a connection pad including a first conductive pad penetrating the first dielectric layer and a second conductive pad penetrating the second dielectric layer, and an adhesive layer between the first dielectric layer and the second dielectric layer, where the adhesive layer includes an organic dielectric material, the first conductive pad and the second conductive pad extend into the adhesive layer, and the first conductive pad directly contacts the second conductive pad.