Chip Bonding with Offset Laser Heating for Solder Precision
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Solution Overview
Problem
Existing laser soldering technologies for bonding semiconductor chips to circuit substrates face inefficiencies and limitations in precision and effectiveness.
Innovation Solution
A chip transferring and bonding device and method that incorporates a signal control module, a chip carrying module, a chip transferring module, and a laser light generation module, allowing for precise focusing of a laser beam to create a light focusing area and a heat radiation area, which cures soldering materials and bonds chips to the circuit substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser beam is focused directly on the chip for soldering, then soldering precision is improved, but the chip may be damaged by excessive heat
Solution Approach 1:
The patent introduces a transparent substrate as an intermediary between the laser beam and the chip. The laser beam passes through the transparent substrate to reach the soldering materials, while the transparent substrate protects the chip from direct laser exposure and excessive heat. This mediator approach allows precise laser soldering without damaging the chip.
2Object-affected harmful factors
If laser beam is focused away from the chip to avoid damage, then chip safety is improved, but soldering precision may be reduced
Solution Approach 1:
The transparent substrate serves as a mediator that allows the laser beam to be focused at a position away from the chip (on the soldering materials side) while still achieving precise soldering. The laser passes through the transparent substrate to cure the soldering materials accurately without directly heating the chip.
Solution Approach 2:
The patent changes the focusing dimension by allowing the laser beam to pass through the transparent substrate and focus on the soldering materials rather than directly on the chip surface. This dimensional shift in focusing position enables both precision and chip protection.
3Device complexity
If traditional laser soldering is used, then bonding process is simple, but bonding efficiency and reliability are insufficient
Solution Approach 1:
The transparent substrate serves multiple functions: it protects the chip from laser damage, allows laser transmission for soldering, and provides a stable mounting surface. This multi-functionality improves bonding efficiency and reliability without significantly increasing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and precise bonding of semiconductor chips to circuit substrates by ensuring each chip is electrically connected through soldering materials, which are effectively cured by the laser-generated heat radiation area, enhancing the reliability and quality of the bonding process.
Implementation Method 1
the laser light generation module is allowed to be configured to generate a laser beam
Implementation Method 2
the soldering materials are allowed to be cured through a predetermined radiation temperature that is provided by the heat radiation area of the laser beam
Data Source
AI summary
A chip transferring and bonding device, a chip bonding device and a chip transferring and bonding method are provided. The chip transferring and bonding device includes a signal control module, a chip carrying module, a chip transferring module and a laser light generation module. The chip transferring module is configured to transfer a plurality of chips to the circuit substrate. When the chips are transferred to the circuit substrate, the laser light generation module is configured to generate a laser beam, and the laser beam is focused at any position away from one of the chips to form a light focusing area and a heat radiation area away from the light focusing area. The soldering materials are allowed to be cured through a predetermined radiation temperature provided by the heat radiation area, thereby making each of the chips bonded on the circuit substrate through the soldering material.