Chip Bonding Sequence for Clean Surface Activation
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Solution Overview
Problem
The existing chip bonding methods face issues with impurities from the etching process adhering to the semiconductor chip's front surface, leading to deteriorated bonding strength and potential defects between the chip and the substrate.
Innovation Solution
A chip bonding system and method that involves dicing a substrate on a sheet to create adjacent chips, activating their bonding surfaces without exposing them to the sheet, and then separating the chips to prevent impurity adhesion, followed by bonding the chips to a substrate while maintaining the sheet's separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the front surface of the semiconductor chip is activated with the back surface stuck to the sheet, then bonding surface activation is achieved, but impurities generated by etching the sheet adhere to the front surface of the semiconductor chip
Solution Approach 1:
The process is segmented into distinct stages: dicing stage (chips adjacent on sheet), activation stage (chips separated to prevent impurity adhesion), and bonding stage (individual chip bonding). This segmentation allows the bonding surfaces to be activated without direct contact with the sheet, preventing impurity adhesion while maintaining activation quality.
Solution Approach 2:
The dicing process is performed preliminarily to create adjacent chips on the sheet before activation. This preliminary arrangement allows subsequent separation during activation, enabling the bonding surfaces to be activated without sheet contact, thus preventing impurity adhesion while ensuring proper activation.
2Object-affected harmful factors
If chips are processed individually from the beginning, then impurity adhesion is prevented, but processing efficiency and productivity decrease
Solution Approach 1:
Multiple chips are merged/processed together during the dicing stage as adjacent chips on the sheet, improving processing efficiency. During the activation stage, the chips are separated to prevent impurity adhesion, and individual bonding is performed. This combination of batch processing and individual treatment resolves the contradiction between productivity and impurity prevention.
Solution Approach 2:
The spatial arrangement of chips is dynamically changed: from adjacent position on sheet during dicing (for efficiency) to separated position during activation (for impurity prevention), and finally to individual positioning during bonding. This dynamic reconfiguration allows the system to optimize for different requirements at different process stages.
Data Source
AI summary
A chip bonding system (1) includes a dicing device (20) to, by dicing a dicing substrate stuck on a sheet (1E), generate a plurality of chips (CP) stuck on the sheet (1E) with chips (CP) adjacent to each other joined to each other via remaining uncut portions, an activation treatment device (60) to activate bonding surfaces of respective ones of the chips (CP) stuck to the sheet (TE), a sheet stretching device (40) to, by stretching the sheet (TE) on which the chips (CP) having bonding surfaces activated by the activation treatment device (60) are stuck, brings the chips (CP) into a state of being separated from one another, and a bonding device (30) to, by bringing one chip (CP) picked out of the chips (CP) separated from one another into contact with a substrate (WT), bond the one chip (CP) to the substrate (WT).