Chip Bonding Apparatus Vertical Flip Transmission
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Solution Overview
Problem
Existing chip bonding apparatuses have low throughput due to long-distance linear transportation of chips and require different bonding apparatuses based on mark surface orientation, limiting efficiency.
Innovation Solution
A chip bonding apparatus with a chip supply unit, substrate supply unit, first and second pickup assemblies with rotating parts and vacuum suction heads, and a vision unit for alignment, allowing for vertical flip transmission and flexible orientation handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chips are transported through long-distance linear transportation from separation table to bonding table, then chips can be bonded onto the bonding table, but bonding throughput is significantly limited
Solution Approach 1:
The patent changes the transportation path from linear (one-dimensional) to radial/circular (two-dimensional) by positioning the separation table and bonding table at opposite ends of a rotating arm. The pickup head rotates to pick up chips from the separation table and delivers them to the bonding table, converting long-distance linear transport into shorter radial movements combined with rotational motion, thereby reducing overall transportation distance and improving bonding throughput.
2Adaptability or versatility
If different bonding apparatus are chosen to meet mark surface orientation requirements, then chips can be bonded with correct orientation, but throughput is additionally reduced
Solution Approach 1:
The patent designs a universal bonding apparatus that can handle both mark surface up and mark surface down orientations using the same separation table and bonding table. The rotating arm mechanism with pickup head can pick up chips in different orientations and deliver them to the bonding table with the required orientation, eliminating the need for separate dedicated apparatus for each orientation type and thereby maintaining high throughput while providing versatility.
3Productivity
If a rotating arm mechanism with separation table and bonding table at opposite ends is used, then transportation distance is reduced and throughput is improved, but the system complexity increases
Solution Approach 1:
The patent merges the separation table and bonding table onto a single rotating arm structure, with both tables positioned at opposite ends. This consolidation allows the pickup head to serve both functions - picking up chips from the separation table and delivering them to the bonding table - within a unified mechanical system. The rotation of the arm provides both transportation and orientation adjustment, reducing the need for separate independent mechanisms and thereby managing system complexity while improving throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves bonding productivity by converting linear transmission to vertical flip transmission and enabling efficient bonding of chips with mark surfaces facing either upward or downward.
Implementation Method 1
each of the first pickup head and the second pickup head is a vacuum suction head
Data Source
AI summary
Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (10); a substrate supply unit (20); a first pick-up assembly (30) arranged between the chip supply unit (10) and the substrate supply unit (20), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly (40) comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly (30) picks up a chip (60) from the chip supply unit (10) or the second pick-up assembly (40), and delivers the chip (60) onto a substrate of the substrate supply unit (20) to complete the bonding; and a vision unit (50) for realizing the alignment of the chip (60) and the substrate on the first pick-up assembly (30), wherein the chip supply unit (10), the substrate supply unit (20), the second pick-up assembly (40) and the vision unit (50) are respectively located on four work positions of the first pick-up head. The chip (60) is transported through rotation, improving the productivity of chip (60) bonding; and the chip (60) is reversed by utilizing the second pick-up assembly (40), which is compatible with two ways of bonding, i.e. a mark face of the chip (60) facing upwards and downwards.