Chip Capacitor Anode Terminal Depression Insulation
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Solution Overview
Problem
Existing chip capacitors face challenges in minimizing size and thickness while maintaining insulation between the cathode layer and anode terminal, as the use of insulating resin increases material costs and manufacturing steps, and alternative designs that eliminate resin result in larger capacitor sizes, compromising volume efficiency.
Innovation Solution
A chip capacitor design where the anode terminal is positioned beneath the capacitor element with a depression on its upper surface, allowing packaging resin to fill the gap and provide insulation, and a connector with a curved surface to ensure resin flow and spacing, eliminating the need for separate resin application between the anode terminal and capacitor element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating resin is applied between the anode terminal and cathode layer, then insulation is achieved, but material cost and manufacturing complexity increase
Solution Approach 1:
The patent introduces a resin layer that fills the depression on the anode terminal surface as an intermediary insulating structure. This resin mediator provides the necessary insulation between the anode terminal and cathode layer while being integrated into the molding process, avoiding separate insulating resin application steps.
Solution Approach 2:
The depression is formed on the anode terminal surface before final assembly, preliminarily creating the insulating structure. This preliminary action ensures that when the cathode layer is placed, the insulation is already in position, eliminating the need for subsequent insulating resin application.
2Volume of moving object
If the anode terminal extends beneath the capacitor element to minimize size, then compactness is achieved, but insulation becomes more difficult without additional resin
Solution Approach 1:
The patent applies local quality by creating a depression only in the specific region where the anode terminal contacts or approaches the cathode layer. This localized structural modification provides insulation precisely where needed, enabling compact design without compromising insulation reliability.
Solution Approach 2:
Instead of providing insulation through horizontal separation, the patent uses vertical dimension by forming a depression on the anode terminal surface. This dimensional approach allows the insulating resin to be contained within the depression, achieving insulation in a compact vertical space rather than requiring horizontal expansion.
3Device complexity
If the upright portion of the anode terminal projects halfway between ends, then insulation without resin is achieved, but the overall capacitor size increases
Solution Approach 1:
The patent nests the insulating resin within the depression formed on the anode terminal surface. This nesting approach allows the insulating structure to be contained within the existing terminal geometry rather than extending outward, maintaining compact overall dimensions while providing necessary insulation.
Data Source
AI summary
A capacitor element having an upper surface, a lower surface, a first end surface and a second end surface is coated with a cathode layer, except for the first end surface. Anode lead extends out from the first end surface. An anode terminal has a first portion located close to and beneath the lower surface of the capacitor element and has a second portion connected to the anode lead via an arcuate connector. A cathode terminal is disposed under the lower surface of the capacitor element, being spaced from the first portion of the anode terminal. A packaging resin covers the capacitor element, the anode terminal and the cathode terminal. A depression is formed in the anode terminal, which extends from a portion of the anode terminal facing the lower surface of the capacitor element to the inner edge of the anode terminal facing the cathode terminal.