Thin/Thick Film Capacitor TRIZ Cases
- Dielectric Composition for High-Frequency Film Components
Complex oxide film composition delivers high relative permittivity and low dielectric loss for downsized electronic components.
- Thin-Film Capacitor Through Holes Suppress Cracking
Through holes in nickel internal electrodes relieve interfacial stress to suppress peeling and cracking, enhancing manufacturing yield.
- Thin Film Capacitor Via Pad Layout for ESL Reduction
Adjacent non-overlapping pads reduce ESL and ESR while preventing contact defects from via dimples during board mounting.
- MLCC Orientation Marking via Non-Active Electrodes
Non-active internal electrodes extend to the capacitor boundary, creating permanent identification marks that survive firing and abrasive treatment.
- High-Density Lead Lanthanum Zirconium Titanate Dielectric for Capacitors
Low-temperature sintering of a lead lanthanum zirconium titanate precursor yields a dense dielectric that maintains stability at high voltages.
- Bi-Zn-Nb-O Dielectric Composition for High-Frequency Component Downsizing
A Bi-Zn-Nb-O dielectric composition delivers high quality factors and adjustable relative permittivity.
- Multilayer Thin-Film Capacitor Split Layer Noise Suppression
Segmented internal electrodes and a split layer suppress high-frequency noise while maintaining compact form factors.