MLCC Orientation Marking via Non-Active Electrodes
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Solution Overview
Problem
Multi-layered ceramic capacitors (MLCCs) face challenges in maintaining orientation marks due to manufacturing processes like firing and abrasive treatment, limiting design flexibility and compatibility with pick and place machinery.
Innovation Solution
Incorporating non-active internal electrodes as identification marks that extend to the outer boundary of the capacitor, allowing for permanent orientation marking that survives firing and tumbling, and can be detected by optical systems for precise mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If orientation marks are applied to MLCC surfaces, then pick and place machinery can identify proper orientation, but the marks are removed during abrasive treatment and firing processes
Solution Approach 1:
The orientation marks are formed during the lamination stage, before the harmful firing and abrasive treatment processes. By creating the marks in advance on the green sheet layers, the marks are embedded into the ceramic structure and survive subsequent processing without being removed or degraded
Solution Approach 2:
The orientation marks are integrated into the ceramic body itself rather than being applied as separate surface coatings. The marks become part of the ceramic matrix through the lamination and firing process, combining the marking function with the structural ceramic material
2Ease of operation
If asymmetrical MLCC designs are implemented to include orientation marks, then proper orientation can be indicated, but the geometrical symmetry required for pick and place machinery compatibility is compromised
Solution Approach 1:
The patent introduces controlled asymmetry through orientation marks that extend to specific edges or corners of the MLCC. This asymmetry is minimal and localized, providing clear directional information to pick and place machinery while maintaining overall geometrical compatibility for automated handling
Solution Approach 2:
The orientation marks are localized to specific regions of the MLCC surface rather than affecting the entire geometry. This allows the bulk of the component to maintain symmetrical characteristics for pick and place compatibility, while only specific local areas exhibit asymmetry for orientation indication
3Ease of operation
If marking processes are added after dicing to provide orientation information, then orientation can be indicated, but the marks cannot survive the subsequent abrasive treatment
Solution Approach 1:
The orientation marks are formed during the lamination stage, before the harmful firing and abrasive treatment processes. By creating the marks in advance on the green sheet layers, the marks are embedded into the ceramic structure and survive subsequent processing without being removed or degraded
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of asymmetrical MLCC designs and preferential orientation, improving manufacturing efficiency and compatibility with pick and place machinery without consuming capacitive space.
Implementation Method 1
sintering the stack
Data Source
AI summary
A method for forming an MLCC with an identification mark consisting of non-active internal electrodes which can be used to determine chip orientation for mounting or reeling. The method includes printing layers, forming a stack of the layers, sintering the stack, dicing the stack and forming external terminations.