Chip Card Antenna Solder Drop Pre-Assembly
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Solution Overview
Problem
The existing methods for manufacturing dual-interface chip cards are complex, affecting productivity and reliability due to separate manufacturing and subsequent intricate connection processes of the electronic module and antenna.
Innovation Solution
A method involving the deposition of solder or brazing material on antenna connection pads to create a pre-assembled antenna inlay, which can be easily integrated with a module during card production, simplifying the connection process and allowing for simultaneous bonding and heating operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the electronic module and antenna are manufactured separately and connected using complex methods, then the card can be assembled with separate components, but the productivity decreases and manufacturing yield is affected
Solution Approach 1:
The invention applies preliminary action by pre-assembling the antenna with its connection pads and pre-positioning solder material on these pads before the final card assembly. This allows the antenna module to be prepared in advance as a ready-to-connect component, eliminating complex connection operations during final assembly and thereby improving productivity while maintaining ease of manufacture.
2Ease of manufacture
If the electronic module and antenna are connected using complex connection methods, then the components can be connected, but the reliability of the card during use deteriorates
Solution Approach 1:
The invention merges the antenna connection pads and solder material into a single integrated assembly. By combining these elements that were previously separate and required complex connection methods, the invention creates a unified structure that is both easier to manufacture and more reliable during card usage, as the merged structure eliminates potential failure points from complex multi-step connections.
3Productivity
If solder material is deposited on antenna connection pads to create pre-assembled inlay, then the connection process is simplified, but additional deposition process is required
Solution Approach 1:
The invention extracts the solder material deposition step as a separate, standardized process that can be applied uniformly to antenna connection pads. By taking out this critical connection-enabling step and making it a distinct deposition process, the invention simplifies the overall connection procedure while managing device complexity through process standardization and automation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly process, enhances manufacturing yield, and improves the reliability of dual-interface chip cards by using pre-assembled components and a single heating operation for both connection and bonding.
Implementation Method 1
The deposition of solder or brazing material (consisting for example of a tin-bismuth alloy), for example in the form of drops, on the connection pads of the antenna
Implementation Method 2
The deposition of solder or brazing material (consisting for example of a tin-bismuth alloy)
Implementation Method 3
a single heating operation then being necessary in order both to connect the module to the antenna and to fix the module in its cavity
Implementation Method 4
The operation of connecting the module to the antenna is greatly simplified by the use of the solder material that is already in place on the connection pads of the antenna
Data Source
AI summary
A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the solder drops remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is placed in each cavity. The areas of the module that are located on the solder drops are heated to melt the solder and to solder the contact pads of the antenna to conductive paths of the module.