Chip Card Contact Array with Dual Interface and Asymmetric Connecting Structure
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Solution Overview
Problem
Chip cards require inconvenient handling as they need to be singularized and inserted into a reading device using a contact-based interface, limiting user experience in electronic payment transactions.
Innovation Solution
A chip card contact array arrangement with a carrier, contact arrays, an electrically conductive structure, plated-through holes, and a connecting structure that runs parallel to the direction of movement in a reading device, allowing for a dual interface communication method using both contact-based and contactless interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If contact-based interface is used for chip card communication, then reliable electrical connection is achieved, but user convenience deteriorates due to inconvenient handling and insertion requirements
Solution Approach 1:
The patent combines both contact-based and contactless communication interfaces into a single chip card system. The contact arrays and electrically conductive structure are integrated on the same carrier, allowing the card to provide both interface types simultaneously, thus improving user convenience while maintaining connection reliability through the contactless option.
Solution Approach 2:
The chip card is designed with multi-functionality by incorporating dual communication interfaces. The contact arrays provide traditional reliable electrical connection, while the additional electrically conductive structure enables contactless communication, making the card adaptable to different usage scenarios and reading devices.
2Adaptability or versatility
If contact arrays are arranged on the carrier surface, then contact-based communication is enabled, but material wear increases during insertion and movement in reading device
Solution Approach 1:
The patent introduces an electrically conductive structure that enables contactless communication as an alternative to the mechanical contact-based interface. This replaces the need for physical insertion and contact friction, thereby reducing material wear while maintaining communication capability.
3Reliability
If connecting structure runs perpendicular to movement direction, then electrical connection is established, but lateral wear and material removal increase
Solution Approach 1:
The patent employs asymmetric arrangement of the connecting structure, positioning it to run parallel to the movement direction rather than perpendicular. This asymmetric orientation minimizes lateral wear and material removal during insertion, while still establishing reliable electrical connection through the plated-through holes.
Data Source
AI summary
In various embodiments, a chip card contact array arrangement is provided, having a carrier, a plurality of contact arrays which are arranged on a first side of the carrier, an electrically conductive structure which is arranged on a second side of the carrier, which is arranged opposite the first side of the carrier, a first plated-through hole and a second plated-through hole, wherein the first plated-through hole is coupled to the electrically conductive structure, a connecting structure which is arranged on the first side of the carrier, wherein the connecting structure connects the first plated-through hole to the second plated-through hole, the connecting structure having a longitudinal extent which runs parallel to a direction in which a contact-connection device on a reading device is moved relative to the plurality of contacts.


