Rectangular shield vias tied to multiple grounds block electromagnetic leakage between closely spaced signal lines and reduce crosstalk tolerance issues.
A multilayer SIW coaxial divider-combiner uses impedance transformation sections to cut loss, reduce bulk, and widen RF bandwidth.
Conductive shadow vias between differential signal vias reshape the electric field to cut crosstalk in dense high-speed connector backplanes.
Via-coupled PCB integration places the cavity resonator close to the amplifier, cutting phase noise while simplifying tuning and assembly.
Quarter-wave stubs and a delay line boost coupling on a single-layer PCB 180° hybrid coupler while keeping broad bandwidth and low return loss.