Multilayer Board Insulating Sheet with Reducing Agent for Hot-Pressing

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Solution Overview

Problem

Existing multilayer board technologies face low connection reliability between conductor posts and wiring layers due to oxide film formation and air gaps, which hinder effective hot-pressing and circuit connectivity.

Innovation Solution

Incorporating a reducing agent in the multilayer board insulating sheet, which volatilizes and decomposes during hot-pressing to remove oxide films, allowing the conductor connection film to melt and spread evenly, thereby improving the connection between conductor posts and wiring layers without generating cracks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If collective stacking hot-pressing is performed in air atmosphere, then manufacturing efficiency is improved, but oxide film forms on conductor connection film surface reducing connection reliability

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidconnection reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

A reducing agent layer is introduced as an intermediary substance between the conductor connection film and the air atmosphere during hot-pressing. This reducing agent layer serves as a mediator that chemically reduces oxide films on the conductor connection film surface, enabling reliable connections while maintaining air atmosphere hot-pressing conditions for manufacturing efficiency.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The reducing agent layer is prepared in advance on the insulating sheet before hot-pressing. This preliminary preparation ensures that when hot-pressing occurs in air atmosphere, the oxide films are immediately reduced by the pre-positioned reducing agent, preventing oxidation damage and ensuring connection reliability from the start of the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If reducing agent amount is increased to improve oxide film removal, then connection reliability is improved, but air gaps and voids increase in the insulating layer

Engineering Contradiction:

Improveconnection reliabilityVSAvoidair gaps and voids

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The concentration of the reducing agent in the insulating layer is precisely controlled within the range of 30 to 200 ppm. This parameter optimization ensures sufficient reducing agent is present to remove oxide films and improve connection reliability, while preventing excessive reducing agent that would cause air gaps and voids during hot-pressing.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the connection reliability between board units by ensuring a strong, crack-free bond, facilitating three-dimensional circuit connections and suppressing air gap formation, thus improving the overall performance of the multilayer board.

Implementation Method 1

by volatilizing and decomposing the reducing agent, the oxide film formed on the surface of the conductor connection film can be removed

Methodology Applied

Scientific EffectVolatilization: Evaporation

Implementation Method 2

by volatilizing and decomposing the reducing agent, the oxide film formed on the surface of the conductor connection film can be removed

Methodology Applied

Scientific EffectDecomposition: Decomposition (biological)

Implementation Method 3

the oxide film formed on the surface of the conductor connection film can be removed

Methodology Applied

Scientific EffectReduction: Reduction

Implementation Method 4

the metal constituting the conductor connection film is easily melted at the time of the collective stacking hot-pressing, air gaps are hardly generated, and the metal constituting the conductor connection film can be wetted and spread over the entire surface of the conductor post

Methodology Applied

Scientific EffectMelting: Melting