Concentric Conductive Pillars for Heat-Resistant Circuit Boards
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Solution Overview
Problem
Current circuit boards in electronic equipment face challenges in maintaining performance and reliability due to heat generated during operation, which affects their structural stability and functionality.
Innovation Solution
A circuit board design featuring a conductive pillar with concentrically arranged cylindrical metal shells and a method of plating using a pulsed current to control shell thickness and number, reducing thermal stress variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional single-layer conductive structure is used, then manufacturing process is simple, but heat resistance and structural stability deteriorate under high temperature
Solution Approach 1:
The conductive structure is segmented into multiple cylindrical metal shells with different thicknesses arranged concentrically. This segmentation allows each layer to handle thermal stress differently, improving overall heat resistance while maintaining structural integrity under high temperature conditions.
Solution Approach 2:
Multiple cylindrical metal shells are nested concentrically within each other, forming a multi-layer conductive structure. The different thicknesses of adjacent shells create a gradient structure that effectively manages thermal expansion and contraction, enhancing reliability without excessive complexity.
2Stability of the object's composition
If uniform thickness metal shells are used, then manufacturing process is simple, but thermal stress variation increases under temperature changes
Solution Approach 1:
Different regions of the conductive structure have different shell thicknesses. The first cylindrical metal shell has a different thickness compared to the second and subsequent shells, creating local variations that compensate for thermal stress. This non-uniform thickness distribution improves structural stability under temperature fluctuations.
Solution Approach 2:
The thickness parameter of the cylindrical metal shells is deliberately varied across different layers. By changing the thickness parameter from one shell to another, the structure adapts to thermal expansion and contraction differently at each layer, reducing overall thermal stress variation and improving stability.
3Manufacturing precision
If pulsed current plating is used to control shell thickness, then manufacturing precision improves, but production time increases
Solution Approach 1:
Pulsed current is applied periodically during the electroplating process to deposit metal layers. The periodic on-off cycling of the current allows precise control over the thickness of each cylindrical metal shell while managing heat generation during plating, achieving both precision and reasonable production efficiency.
Solution Approach 2:
The pulsed current parameters (amplitude, duty cycle, frequency) are optimized to achieve the desired shell thickness precision. By carefully controlling these electrical parameters, the manufacturing precision of shell thickness is improved while minimizing the impact on production time through efficient plating cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the circuit board's structural stability under high temperatures, ensuring normal operation and improved performance and reliability of electronic devices.
Implementation Method 1
applying a pulsed current to the first cylindrical metal shell to plating (N-1) cylindrical metal shells on the 1st cylindrical metal shell
Implementation Method 2
the 1st cylindrical metal shell referred to in the aforementioned method of circuit plating is formed by electroless plating
Data Source
AI summary
A circuit board and a method of circuit plating thereof are provided. The circuit board includes a substrate, a conductive pillar and a first circuit layer. The substrate includes a first surface, a second surface opposite the first surface, and a hole extending from the first surface toward the second surface. The first circuit layer is disposed on the first surface and is connected to the conductive pillar. The conductive pillar includes N cylindrical metal shells disposed inside the hole and arranged in a concentric pattern, in which a (K-1) cylindrical metal shell surrounds and covers the Kth cylindrical metal shell, and an interface is formed between the (K-1) and the Kth cylindrical metal shells, and the 1st cylindrical metal shell covers and contacts a sidewall of the hole, in which N and K are both positive integers and N≥K≥3.