Laminated Substrate With One-Sided Conductors Reducing Transmission Loss

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional multilayer substrates with incorporated electronic components experience increased transmission loss due to lengthy wiring patterns, which complicates connections and increases signal loss between components.

Innovation Solution

A component incorporating substrate design where thermoplastic insulating base members with conductors on only one surface are laminated such that the conductor-less surfaces face each other, reducing the length of conductors between components and incorporating an alloy layer for improved connection reliability, along with a method involving through holes filled with electrically-conductive paste and bonding under pressure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional multilayer substrates with conductor patterns on multiple surfaces are used to connect electronic components, then connectivity between components is achieved, but transmission loss increases due to lengthy wiring patterns

Engineering Contradiction:

Improveconnection reliabilityVSAvoidtransmission loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

Instead of placing conductor patterns on multiple surfaces of base members and routing signals through lengthy paths, the invention inverts the approach by placing conductor patterns on only one surface of each base member. This allows the common conductor pattern to be positioned between electronic components in the lamination direction, significantly shortening the conductor length and reducing transmission loss while maintaining reliable connectivity.

Inventive Principle:

Principle #13The other way round (Inversion)

2Adaptability or versatility

If conventional multilayer substrates with multiple conductor patterns on different layers are used, then electronic components can be connected, but the wiring patterns become complex and transmission loss increases

Engineering Contradiction:

Improvecomponent connectivityVSAvoidwiring pattern complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention extracts the common conductor pattern from the conventional multi-surface conductor configuration and positions it specifically between electronic components in the lamination direction. This eliminates the need for complex interlayer wiring patterns while maintaining connectivity, thereby reducing wiring pattern complexity and transmission loss simultaneously.

Inventive Principle:

Principle #2Taking out (Extraction)

3Loss of energy

If thermoplastic insulating base members with conductors on one surface are laminated with conductor-less surfaces facing each other, then conductor length is reduced and transmission loss decreases, but manufacturing process becomes more specific

Engineering Contradiction:

Improvetransmission lossVSAvoidmanufacturing process flexibility

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The invention applies local quality by specifying that conductor patterns are placed on only one surface of each thermoplastic insulating base member, while the opposite surface remains conductor-less. This local differentiation allows the common conductor pattern to be positioned optimally between electronic components, reducing transmission loss while the standardized one-sided conductor configuration simplifies the manufacturing process through consistent processing steps.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces transmission loss by shortening conductor lengths and enhancing connection reliability, allowing for more efficient high-frequency signal transmission between electronic components.

Implementation Method 1

bonding them by heating under pressure

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

heating under pressure

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 3

the electrically-conductive paste is solidified when the base members are bonded by heating under pressure

Methodology Applied

Scientific EffectSolidification: Freezing

Data Source

PatentUS9854682B2Component incorporating substrate and method for manufacturing component incorporating substrate

Publication Date: 2017.12.26 MURATA MFG CO LTD

AI summary

A laminated body of a component incorporating substrate includes insulating base members. First and second mounting terminals of a first electronic component abut on a conductor-less surface of a first insulating base member. A first interlayer connection conductor in the first insulating base member connects the first mounting terminal to a conductor pattern. Third and fourth mounting terminals of a second electronic component abut on a conductor-less surface of a second insulating base member. A second interlayer connection conductor in the second insulating base member connects the third mounting terminal to a conductor pattern that abuts a conductor pattern of the first insulating base member which faces toward the second insulating base member, and the conductor pattern of the second insulating base member faces toward the first insulating base member in a lamination direction.