Chip Carrier Conductive Structures Extend Beyond Dielectric Sheet
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional chip carriers for power modules, especially in automotive applications, face challenges in simplifying manufacturability while efficiently removing heat and providing extended functionality.
Innovation Solution
A chip carrier with thermally conductive and electrically insulating sheets featuring electrically conductive structures on both main surfaces that extend beyond the lateral edges, allowing for reduced material usage and integrated functionality such as mounting and wiring, while maintaining high thermal performance through double-sided cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If the dielectric thermally conductive sheet is reduced in dimension, then cost and weight are reduced, but thermal performance may be compromised
Solution Approach 1:
The chip carrier is segmented into a reduced-dimension dielectric thermally conductive sheet and extended electrically conductive structures that perform multiple functions. The sheet handles core thermal conduction while the conductive structures extend for mounting and wiring, allowing the sheet to be smaller without compromising overall thermal performance.
Solution Approach 2:
The electrically conductive structures are designed to serve multiple functions: they extend beyond the sheet edges to provide mounting surfaces for electronic chips, act as wiring structures for electrical coupling, and contribute to heat dissipation. This multi-functionality allows the dielectric sheet to be reduced in size while maintaining system performance.
2Adaptability or versatility
If electrically conductive structures extend beyond the sheet edges, then functionality is extended, but manufacturing complexity increases
Solution Approach 1:
The invention merges previously separate components into a unified structure. The electrically conductive structures are integrated directly with the dielectric thermally conductive sheet, combining the substrate and conductor functions. This integration extends functionality for mounting and wiring while actually simplifying manufacturing by reducing the number of discrete parts and assembly steps.
3Quantity of substance
If the dielectric thermally conductive sheet is reduced in dimension, then material cost is reduced, but electrical functionality may be limited
Solution Approach 1:
The electrically conductive structures extend in the lateral dimension beyond the edges of the dielectric sheet, utilizing the spatial dimension to provide extended functionality. This allows the sheet itself to be smaller (reducing material usage) while the conductive structures provide the necessary electrical mounting and wiring surfaces through their extended geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the cost and weight of the chip carrier and package, enhances electrical functionality, and maintains effective heat spreading, achieving high thermal performance, flexibility, and extended functionality with simplified manufacturing.
Implementation Method 1
a thermally conductive and electrically insulating sheet
Implementation Method 2
a thermally conductive and electrically insulating sheet
Implementation Method 3
a first electrically conductive structure on a first main surface of the sheet, and a second electrically conductive structure on a second main surface of the sheet
Data Source
AI summary
A chip carrier which comprises a thermally conductive and electrically insulating sheet, a first electrically conductive structure on a first main surface of the sheet, and a second electrically conductive structure on a second main surface of the sheet, wherein the first electrically conductive structure and the second electrically conductive structure extend beyond a lateral edge of the sheet.