Semiconductor Chip Contact Ridge Structure for Precise Alignment
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Solution Overview
Problem
The precise alignment and secure mounting of optoelectronic semiconductor chips, such as LEDs and sensors, with defined emission directions are challenging, especially in displays requiring uniform emission patterns, and existing flat contact pads tend to tilt during bonding, affecting the overall system performance.
Innovation Solution
The semiconductor chip design features a bottom coating with a thickness gradient and ridge lines, where the electrode layer extends over the ridge lines to create a contact side that conforms to the shape of the bottom coating, providing an electrical and mechanical contact plane for precise orientation and secure attachment, even with non-conductive adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat contact pad is used for mounting the semiconductor chip, then the manufacturing process is simple, but the chip tilts during bonding affecting alignment precision
Solution Approach 1:
The contact pad is designed with a thickness gradient, creating different local heights (first contact region higher than second contact region). This local quality variation provides both mechanical support and precise alignment reference, resolving the contradiction between simple mounting and precise alignment.
Solution Approach 2:
The contact pad features a curved upper surface with defined slope angles instead of a flat surface. This curvature design allows the chip to be mounted at a precise angle while maintaining simple bonding processes, eliminating tilting issues.
2Device complexity
If the contact pad has uniform thickness, then the structure is simple, but it cannot provide defined emission direction control
Solution Approach 1:
The contact pad employs local quality variation through thickness gradient and slope angle differences in different regions. This enables precise control of chip orientation and emission direction while maintaining relatively simple overall structure.
Solution Approach 2:
The contact pad uses asymmetric design with different slope angles in first and second contact regions. This asymmetry provides defined emission direction control by orienting the chip at specific angles during mounting.
3Reliability
If a thicker bottom coating is used for better electrical connection, then electrical conductivity improves, but the chip height increases affecting alignment
Solution Approach 1:
The bottom coating uses thickness gradient with thicker regions for electrical contact and thinner regions for alignment reference. This local quality differentiation ensures both reliable electrical connection and precise alignment control.
Solution Approach 2:
The solution transitions from uniform thickness (one-dimensional) to thickness gradient (three-dimensional variation). This dimensional change allows simultaneous optimization of electrical conductivity (thicker regions) and alignment precision (thinner regions with defined slopes).
Data Source
AI summary
In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence with a bottom side, a bottom coating located on the bottom side and an electrode layer located on an underside of the bottom coating facing away from the semiconductor layer sequence, wherein the bottom coating has a thickness gradient and at least one ridge line at which the bottom coating is thickest, wherein the electrode layer extends over the at least one ridge line such that a contact side of the electrode layer facing away from the semiconductor layer sequence follows the bottom coating true to shape, and wherein an electrical and mechanical contact plane of the contact side parallel to the bottom side is defined by the at least one ridge line.