Chip Component Cover Layer Reduces Stray Capacitance
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Solution Overview
Problem
Chip-type electronic components face challenges in reducing stray capacitance between inner electrodes and other electrode members in directions orthogonal to the component's thickness, which affects desired capacitance and component performance.
Innovation Solution
A chip-type electronic component with a cover layer made of insulation material having lower permittivity than the chip element assembly, covering at least part of the side surface orthogonal to the thickness direction, reduces unnecessary stray capacitance between inner electrodes and other electrode members, and allows for improved design flexibility by eliminating the need for gaps and enhancing protection against external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gaps are formed to prevent short-circuits between inner electrodes and external electrode members, then reliability is improved, but design freedom and compactness are reduced
Solution Approach 1:
The cover layer acts as an intermediary insulating structure between the inner electrodes and external electrode members. It provides electrical isolation and short-circuit prevention without requiring gaps in the inner electrode design, thus maintaining design freedom while ensuring reliability.
Solution Approach 2:
The cover layer is formed beforehand on the side surfaces to provide protective insulation before the inner electrodes are exposed to external electrode members. This preemptive insulation measure prevents potential short-circuits without constraining the inner electrode configuration.
2Ease of operation
If the end portion of inner electrodes is exposed from the side surface for connection, then ease of connection is improved, but susceptibility to external impacts and short-circuits increases
Solution Approach 1:
The cover layer forms a protective shell on the side surfaces, enclosing the exposed end portions of inner electrodes. This shell provides mechanical protection against external impacts while maintaining electrical isolation, thus protecting against both physical damage and short-circuits.
Solution Approach 2:
The cover layer serves as an intermediary protective barrier between the exposed inner electrode end portions and external environment. It allows electrical connection while shielding against harmful external factors such as impacts and moisture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes stray capacitance in orthogonal directions, enabling the achievement of desired characteristics and design freedom while preventing short-circuits and protecting against external impacts.
Implementation Method 1
a cover layer that is formed with an insulation material having a lower permittivity than the chip element assembly and is so provided as to cover at least a part of the side surface of the chip element assembly
Data Source
AI summary
A chip-type electronic component 1a mounted on a board includes a chip element assembly 2 having an upper surface, a lower surface, and a side surface; inner electrodes 3a, 3b, and 3c formed inside the chip element assembly 2; and a cover layer 5 that is formed with an insulation material having a lower permittivity than the chip element assembly 2 and is so provided as to cover at least part of the side surface of the chip element assembly 2. With this structure, unnecessary stray capacitance between the inner electrodes 3a, 3b, and 3c formed inside the chip element assembly 2 and other electrode members arranged outside the cover layer 5 in a direction orthogonal to a thickness direction of the chip element assembly 2 can be reduced, whereby the chip-type electronic component 1a capable of realizing the desired characteristics can be provided.