Magnetic Chip Discharge Path With Withdrawn Support Surface

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Solution Overview

Problem

Existing methods for magnetic-belt chip conveyors do not effectively reduce the quantity of coolant discharged with chips, leading to inefficient coolant recovery and increased material and design complexities.

Innovation Solution

The method involves deflecting the return flow out of the discharge path and temporarily withdrawing the supporting surface from the discharged chips, creating a jumping movement that enhances coolant release, thereby reducing the amount of coolant carried with chip accumulations and optimizing the discharge path parameters such as width, gradient, and magnet spacing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the discharge region is made longer to improve coolant release, then coolant recovery improves, but material requirement and footprint increase

Engineering Contradiction:
Improvecoolant lossVSAvoidmaterial requirement
Core Design Contradiction:
Loss of energyVSWeight of stationary object

Solution Approach 1:

The patent introduces a movable support surface that can be temporarily withdrawn from under the chip accumulations during discharge. This dynamic element allows the system to change its configuration during operation - providing support when needed and removing it to enhance coolant release, thereby achieving better coolant recovery without requiring a longer fixed discharge region structure

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The support surface is periodically withdrawn and repositioned during the chip discharge process. This periodic action creates intermittent free-fall phases for the chip accumulations, which enhances coolant release at critical moments without requiring the discharge region to be continuously extended in length

Inventive Principle:
Principle #19Periodic action

2Loss of energy

If the conveying speed is increased to improve coolant release, then coolant recovery improves, but the time available for return flow decreases

Engineering Contradiction:
Improvecoolant lossVSAvoidreturn flow time
Core Design Contradiction:
Loss of energyVSLoss of time

Solution Approach 1:

The periodic withdrawal of the support surface creates intermittent acceleration phases that enhance coolant release at specific moments during the discharge cycle. This allows effective coolant separation without requiring continuously high conveying speeds, thereby preserving adequate time for coolant return flow

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The system dynamically changes the conveying parameters by temporarily increasing speed during the support withdrawal phase and reducing it during the return flow phase. This variable speed approach optimizes coolant release when needed while maintaining sufficient time for coolant recovery overall

Inventive Principle:
Principle #35Parameter changes

3Loss of energy

If magnets are spaced closer together to reduce chip accumulation cross section, then coolant release improves, but the number of magnets and material expenditure increase

Engineering Contradiction:
Improvecoolant lossVSAvoidnumber of magnets
Core Design Contradiction:
Loss of energyVSQuantity of substance

Solution Approach 1:

The movable support surface creates dynamic discharge conditions that enhance coolant release without requiring increased magnet density. By temporarily removing support during discharge, the system achieves effective coolant separation using the existing magnet spacing, avoiding the need to install additional magnets

Inventive Principle:
Principle #15Dynamics

4Weight of stationary object

If the discharge path width is reduced to lower material expenditure, then manufacturing cost decreases, but conveying capacity is limited

Engineering Contradiction:
Improvematerial requirementVSAvoidconveying capacity
Core Design Contradiction:
Weight of stationary objectVSProductivity

Solution Approach 1:

The movable support surface allows the discharge path to dynamically adapt its effective width. During normal operation, the full width is available for conveying. During discharge phases, the support withdrawal enhances coolant release across the available width, maximizing the utility of the reduced- width structure

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces the amount of coolant reabsorbed by advancing chip accumulations, allowing them to reach the end of the discharge path in a drier state, improving coolant recovery and reducing material requirements and design complexities.

Implementation Method 1

a chip discharge device for discharging the chips along a discharge path counter to the downhill force by means of a magnetic force

Methodology Applied
Scientific EffectMagnetic force: Magnetism

Implementation Method 2

which device allows a return flow of the liquid carried away by the discharged chips, which flow is caused by the downhill force

Methodology Applied
Scientific EffectGravity: Gravitation

Data Source

PatentUS11504721B2Method and device for the chip-removing production or machining of a workpiece with subsequent chip discharge
Publication Date: 2022.11.22 GLEASON PFAUTER MASCHFAB
  • US11504721B2 patent drawing
  • US11504721B2 patent drawing
  • US11504721B2 patent drawing

AI summary

The invention relates to a method for the chip-removing production or machining of a workpiece by means of a tool, in which method a liquid, which mixes and accumulates with the chips produced during the machining process, is used for lubricating and/or cooling the machining process, and the chips are discharged from the accumulation counter to the downhill force along a discharge path by means of a magnetic force, wherein a return flow of the liquid carried by the discharged chips occurs due to the downhill force, and the return flow is deflected out of the discharge path and/or the discharge path has at least one point at which the supporting surface is temporarily withdrawn from the discharged chips.