Semiconductor Chip Encapsulation via Pressing Molding Material
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Solution Overview
Problem
Current methods for producing packaged semiconductor devices face challenges in productivity and process engineering efficiency, particularly in the use and handling of molding materials, which can lead to inaccuracies and increased costs.
Innovation Solution
A method involving the arrangement of semiconductor chips on a carrier, filling a cavity or mold with a molding material, pressing the chips into the material, and separating the embedded chips from the carrier, using both liquid and non-liquid molding materials to achieve encapsulation and improve process efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional potting processes are used with liquid molding material, then encapsulation is achieved, but productivity decreases due to process complexity
Solution Approach 1:
The method merges multiple conventional process steps into a single integrated operation. By combining the material deposition, chip embedding, and encapsulation into one unified process where chips are pressed directly into molding material on the carrier, the method eliminates separate handling steps, reduces process complexity, and improves productivity while maintaining encapsulation reliability.
2Reliability
If molding material is handled in conventional methods, then encapsulation is achieved, but material handling inaccuracies increase costs
Solution Approach 1:
The method implements self-service by having the molding material automatically form a base layer on the carrier that precisely positions itself for chip embedding. The material's own properties and the pressing action work together to achieve accurate chip placement and complete encapsulation without requiring additional handling equipment or complex material manipulation steps, thereby reducing costs while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances productivity by allowing the use of diverse molding materials, reduces chip displacement, and improves the accuracy of redistribution wiring, resulting in a more cost-effective and precise encapsulation process.
Implementation Method 1
filling a mold with a non-liquid molding material; liquefying the molding material
Data Source
AI summary
A method comprises: arranging a plurality of semiconductor chips above a carrier, wherein active main surfaces of the semiconductor chips face the carrier; filling a cavity with a molding material; pressing the semiconductor chips arranged on the carrier into the molding material; and separating the molding material with the semiconductor chips embedded therein from the carrier, wherein main surfaces of the semiconductor chips that are situated opposite the active main surfaces are covered by the molding material.