Semiconductor Chip Fabrication Using Support With Weakening Pattern
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Solution Overview
Problem
Existing methods for fabricating semiconductor chips on thin layers face limitations, particularly with scribing issues that lead to flaking and mechanical rigidity problems, making them unsuitable for applications requiring flexibility or thin substrates, such as LEDs and flexible silicon chips.
Innovation Solution
A method involving the creation of a support with a weakening pattern, where a semiconductor layer with chips is transferred onto the support, and individual chips are cut using this pattern, allowing for the separation of chips without scribing the thin layer, thereby overcoming scribing-related issues and enabling chip production on thinner substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If scribing is used to separate chips from the substrate, then chips can be separated, but flaking occurs and the process is unsuitable for thin substrates
Solution Approach 1:
The patent introduces a support layer as an intermediary between the thin semiconductor layer and the cutting process. The support layer has a weakening pattern that allows clean separation without directly scribing the thin semiconductor layer, thus preventing flaking while enabling chip separation.
Solution Approach 2:
The weakening pattern is formed on the support layer before the chip separation process. This preliminary action creates predetermined fracture lines that guide the cutting process, ensuring clean separation without requiring direct scribing of the thin semiconductor layer.
2Adaptability or versatility
If the substrate is thinned to provide mechanical flexibility, then flexibility is improved, but the substrate becomes too thin for conventional scribing processes
Solution Approach 1:
The support layer acts as a mediator that provides mechanical strength during the manufacturing process while allowing the semiconductor layer to remain thin for flexibility applications. The weakening pattern in the support enables clean separation without compromising the thinness of the semiconductor layer.
Solution Approach 2:
The support layer is segmented through the weakening pattern into regions that can be cleanly separated. This segmentation allows the thin semiconductor layer to be divided into individual chips without requiring the substrate to be thick enough for conventional scribing.
3Strength
If a massive substrate is used to maintain mechanical strength, then structural integrity is improved, but the substrate thickness is too large for applications requiring flexibility or thin profiles
Solution Approach 1:
The support layer is divided into segments by the weakening pattern, allowing each chip to be separated individually. This segmentation enables the use of thin semiconductor layers while the support provides the necessary mechanical strength during processing.
Solution Approach 2:
The support layer serves as an intermediary structure that provides mechanical strength during fabrication and handling, while the thin semiconductor layer maintains its flexibility for the final application. The weakening pattern allows clean separation of the support from the thin semiconductor chips.
Data Source
AI summary
A method of fabricating a plurality of chips, with each chip including at least one circuit. This method includes the successive steps of creating chips on a layer of semiconductor material that is integral with a substrate; forming a weakening pattern corresponding to a predetermined cutting pattern on a support; transferring the chip-containing layer from the substrate to the support; and forming individual chips by cutting the chip-containing layer in accordance with the predetermined cutting pattern. Also, an assembly for fabricating a plurality of chips, each chip including at least one circuit provided on a layer of semiconductor material that is carried by a support that includes a weakening pattern corresponding to a predetermined cutting pattern for forming individual chips, with the support being obtained by assembling a plurality of individual tiles with boundaries between the individual tiles corresponding to the weakening pattern. The tiles may be assembled by disposing a binder between the individual tiles, with the binder ensuring temporary bonding of the tiles.