Chip Handler with Traveling Buffers for Dual Robotic Arms
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Solution Overview
Problem
Current robotic chip testers face challenges in increasing throughput due to longer distances traveled by robotic arms, potential collisions, and delays, especially when testing high-density memory chips, which are costly and time-consuming.
Innovation Solution
The implementation of a multi-robotic-arm test system with non-overlapping roaming areas and traveling buffers that transfer chips between the arms, allowing for efficient chip handling and testing without collisions, and enabling simultaneous testing of multiple chips on multiple test boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple robotic arms are added to increase test throughput, then productivity is improved, but collisions among robotic arms occur and delays increase
Solution Approach 1:
The system divides the workspace into separate roaming areas for each robotic arm, preventing collisions and eliminating waiting delays. Each arm operates independently in its designated zone, allowing simultaneous operations without interference.
Solution Approach 2:
Traveling buffers serve as intermediary components that transfer chips between robotic arms without requiring the arms to directly interact or coordinate their movements. This mediator enables efficient chip transfer while maintaining independent operation of each robotic arm.
2Productivity
If the number of test sockets is increased to improve throughput, then productivity is improved, but robotic arms must travel longer distances
Solution Approach 1:
Traveling buffers act as mobile intermediaries that bring chip storage closer to each robotic arm's working position. This reduces the distance robotic arms must travel to access chips, as the buffers move to positions near the arms rather than requiring arms to traverse long distances to fixed storage locations.
Solution Approach 2:
The traveling buffers are dynamic components that move between different positions, adapting their location to minimize robotic arm travel distance. This dynamic positioning allows the system to maintain high throughput with reduced arm movement compared to static storage configurations.
3Manufacturing precision
If high-density memory chips are tested, then manufacturing precision is improved, but test time increases
Solution Approach 1:
The system maintains continuous operation by having multiple robotic arms work simultaneously in parallel, with traveling buffers continuously supplying chips to each arm. This continuous multi-parallel processing compensates for the increased test time of individual high-density chips, maintaining overall system efficiency.
Data Source
AI summary
Two robotic arms roam in separate, non-overlapping areas of a test station, avoiding collisions. A traveling buffer moves along x-tracks between a front position and a back position. In the front position, a first robotic arm loads IC chips from an input tray or stacker into buffer cavities in the traveling buffer. The traveling buffer then moves along the x-tracks to the back position, where a second robotic arm moves chips from the traveling buffer to test boards for testing. After testing, the second robotic arm moves chips to a second traveling buffer, which then moves along tracks to a front position for unloading by the first robotic arm. Two traveling buffers may move on the same tracks in a loop. The buffer cavities in the traveling buffer move on internal tracks to expand and contract spacing and pitch between the front and back positions to match test-board pitch.