Semiconductor Chip Heat Transfer Bumps for Display Driver Reliability
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Solution Overview
Problem
As display driver integrated circuit (DDI) chips generate significant heat due to increased functionality in larger displays like LCDs, existing packaging technologies, such as COF and COG, lack effective heat management, leading to reliability issues when natural air cooling methods fail to suffice.
Innovation Solution
The implementation of heat transfer bumps and lines connected to metal interconnection lines, which transfer heat from channel blocks to external interconnection lines, allowing for efficient heat dissipation without damaging active devices, and the use of conductive materials like gold for enhanced heat emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If natural air cooling methods are used for heat dissipation, then the structure remains simple and manufacturing is easy, but heat management becomes insufficient leading to reliability issues
Solution Approach 1:
The patent segments the bump structures into two distinct types: normal bumps for electrical connection and heat transfer bumps for thermal management. This segmentation allows the heat dissipation function to be separated from the electrical connection function, enabling effective heat management without compromising the simplicity of the overall packaging structure. The heat transfer bumps are specifically positioned over metal interconnection lines to facilitate heat conduction away from the chip.
2Reliability
If heat transfer bumps are added to improve heat dissipation, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the heat transfer function with the existing bump bonding process by forming heat transfer bumps alongside normal bumps during the same packaging process. Both types of bumps are created using the same bump formation technology and are bonded to the substrate in a single process step, eliminating the need for separate manufacturing steps and maintaining ease of manufacture while adding heat management capability.
3Temperature
If more bumps are used for heat transfer, then heat dissipation improves, but the risk of damaging active devices increases
Solution Approach 1:
The patent applies local quality by positioning heat transfer bumps specifically over metal interconnection lines rather than uniformly across the chip surface. This localized placement ensures that heat is extracted at the points where it is generated and conducted through the metal lines, while avoiding the application of pressure or thermal stress directly over sensitive active devices. The metal interconnection lines serve as heat conduction paths to transport heat away from the chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat generated within the chip, improving the reliability of DDI chip operation by ensuring efficient heat dissipation without compromising the integrity of active devices, thereby enhancing the performance and longevity of the semiconductor chip.
Implementation Method 1
a plurality of second metal interconnection lines placed between the channel blocks, each of the second metal interconnection lines being connected to one of the substrate and a corresponding well region
Implementation Method 2
a plurality of first heat transfer bumps placed over the second metal interconnection lines to receive the heat generated during driving the channel blocks through the second metal interconnection lines and transfer the received heat to a plurality of second external interconnection lines
Data Source
AI summary
A semiconductor device chip includes channel blocks each of which includes channels, each of the channels including unit devices placed in a substrate and well regions; first metal interconnection lines connected to the unit devices comprising the channels to receive and transfer data signals from and to the external side; normal bumps for transferring the data signals received by the first metal interconnection lines through first external interconnection lines to be connected to the external side; second metal interconnection lines placed between the channel blocks, each of the second metal interconnection lines being connected to one of the substrate and a corresponding well region; and first heat transfer bumps placed over the second metal interconnection lines to receive the heat generated during driving the channel blocks through the second metal interconnection lines and transfer the received heat to second external interconnection lines to be connected to the external side.