Chip-Housing Module With Differential Opening Spacing
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Solution Overview
Problem
Traditional high-voltage power semiconductor housings are large and inefficient, leading to board space limitations and a need for a more integrated solution to accommodate multiple high-voltage chips in high-voltage applications.
Innovation Solution
A chip-housing module with a carrier featuring multiple openings at different pre-determined distances to accommodate high-voltage chips, allowing for efficient voltage distribution and integration of multiple chips in a compact form, suitable for high-voltage applications such as lamp ballast circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-voltage power semiconductors are arranged in discrete housing modules to ensure insulation, then high-voltage components are well insulated from each other, but the housing size becomes very large resulting in board space limitations
Solution Approach 1:
The patent combines multiple high-voltage power semiconductor chips (first chip and second chip) into a single integrated housing module. The carrier structure accommodates both chips with their respective connections, merging what were traditionally separate discrete modules into one compact unit. This reduces the total board space required while maintaining the necessary insulation between high-voltage components through the carrier's structural design and spacing arrangements.
2Area of stationary object
If multiple high-voltage chips are integrated in a compact module, then board space is optimized, but the distance between voltage connections must be carefully controlled to maintain insulation
Solution Approach 1:
The patent implements different spacing arrangements for different openings based on their voltage requirements. The carrier has a first plurality of openings for first voltage range connections and a second plurality of openings for second voltage range connections, with specific distance requirements between pairs of openings. This local differentiation of spacing requirements allows compact integration while maintaining appropriate insulation distances where needed, balancing space optimization with manufacturing precision requirements.
Data Source
AI summary
A chip-housing module is provided, the chip-housing module including a carrier configured to carry one or more chips; the carrier including a first plurality of openings, wherein each opening of the first plurality of openings is separated by a first pre-determined distance, and is configured to receive a chip connection for providing a voltage lying within a first range of voltage values to a chip; the carrier including a second plurality of openings, wherein each opening of the second plurality of openings is separated by a second pre-determined distance, and is configured to receive a chip connection for providing a voltage lying within a second range of voltage values to a chip; and wherein a pair of openings consisting of one opening of the first plurality of openings and one opening of the second plurality of openings is separated by a distance different from at least one of the first pre-determined distance and the second pre-determined distance.