Chip Inductor Coil Conductor Pattern Thickness Gradient
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Previous inductor coil structures manufactured by substrate plating processes lack the improved characteristics of reduced coil widths and thicknesses from the outermost to the innermost coil conductor patterns, leading to limitations in inductance and DC resistance, resulting in suboptimal quality factor performance.
Innovation Solution
The implementation of a chip electronic component with coil conductor patterns where the innermost loop section has a smaller thickness and width compared to the outermost and inner loops, achieved through controlled plating techniques and the use of dams to suppress excessive growth, allowing for a gradual reduction in coil dimensions from the outer portion to the inner portion of the magnetic material body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If substrate plating process is used to manufacture inductor coil structures, then manufacturing simplicity is maintained, but the coil conductor patterns have uniform thickness and width which limits inductance and DC resistance characteristics
Solution Approach 1:
The coil conductor pattern is segmented into multiple sections (first section, second section, third section) with different thickness and width characteristics. The first section has greater thickness and width, the second section has intermediate dimensions, and the third section has smallest dimensions. This segmentation allows each section to be optimized for its specific function while maintaining overall coil structure integrity.
Solution Approach 2:
Different sections of the coil conductor pattern are given different local qualities in terms of thickness and width. The outer sections have greater dimensions for structural stability and connection, while the inner sections have reduced dimensions to optimize inductance and reduce AC resistance. This local differentiation resolves the contradiction between manufacturing simplicity and performance optimization.
2Ease of manufacture
If uniform coil conductor patterns are used throughout the coil structure, then manufacturing process is simplified, but inductance and DC resistance characteristics are suboptimal
Solution Approach 1:
The coil conductor pattern transitions from static uniform dimensions to dynamic varying dimensions along its length. The thickness and width change progressively from the first section to the third section, creating a dynamic structure that optimizes electrical characteristics while maintaining manufacturing feasibility through controlled variation rather than complete complexity.
3Ease of manufacture
If plating layers are applied uniformly to all coil sections, then manufacturing consistency is maintained, but outermost and innermost patterns develop excessive plating width
Solution Approach 1:
The manufacturing process applies preliminary anti-action by using different plating strategies for different sections. Internal patterns receive uniform plating treatment, while outermost and innermost patterns receive controlled or limited plating to prevent excessive width development. This anticipatory control prevents the harmful effect of excessive plating before it occurs.
Solution Approach 2:
The plating process is differentiated by location, with internal coil sections receiving standard uniform plating treatment and outermost/innermost sections receiving modified plating treatment to control their width. This local differentiation in plating quality prevents excessive plating width in critical sections while maintaining manufacturing consistency overall.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the quality factor and DC resistance characteristics of the inductor by maintaining high inductance while reducing AC resistance at high frequencies, thereby improving the overall performance of the chip inductor.
Implementation Method 1
An inductor, a chip electronic component, can be a representative passive element configuring an electronic circuit and can be used together with a resistor and a capacitor for example to remove noise. Such an inductor can be combined with such a capacitor using electromagnetic property to configure a circuit such as a resonance circuit, a filter circuit, or the like, and can be used, for example, for amplifying a signal in a specific frequency band.
Data Source
AI summary
A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.