Printed Circuit Aspects TRIZ Cases

Mn(II) catalyst enables conductive polymer formation on dielectric substrates, reducing solution waste and increasing throughput in PCB metallization.

Conductive paste blocks bridge vias and components on double-sided PCBs without precise alignment machinery.

A wiring circuit board uses a segmented ground lead residual portion with an insulating through hole to form a uniform electroless plating layer.

Segmented adhesive members bond layers outside the bending zone, preventing delamination and lifting defects during bezel shaping.

Epoxy resin composition with high thermal conductivity inorganic fillers forms insulating layers.

A photosensitive resin composition stabilizes pattern formation using a naphthalene-based polymerization inhibitor.

Porous filler reduces dielectric constant in insulating layers while maintaining rigidity, enabling precise via hole formation at 50 μm or less.

Non-uniform terminal widths and intervals reduce contact resistance and wiring path complexity to maintain stable voltage levels.

Alignment layer expands vertical projection area to provide sufficient alignment tolerance for conductive posts.

A multilayer circuit board uses conductive paste in through holes to join metal layers on insulating substrates without adhesive.

Segmented build-up layers with varying insulating roughness manage thermal expansion stress to prevent conductor peeling at via hole interfaces.

Stacked via pads in the outer lead region shrink bezel size while maintaining electrical connection reliability.

A wire dispensing device positions and cuts conductive filaments for complex electronic structures.

A single-layered circuit board design places conductive wirings on one surface to improve electrical connection reliability.

Rectangular and trapezoidal conductor shapes improve resin filling in narrow spaces, preventing peeling during thermal cycles.

Nonuniform ground via spacing blocks undesired propagation modes in multilayer substrates, reducing noise radiation from transmission lines.

A transformer integrated printed circuit board places a thick primary winding in the surface layer to carry high current.

Computer modeling predicts warpage to guide differential resin curing, reducing solder joint failures and production costs.

A laminate panel embeds a power device within a recessed graphite and metal substrate to direct heat flux toward a cold plate.

Thermally conductive resin fills through-holes around inserted members, preventing adhesion degradation under high temperatures.

A transparent substrate integrates a side surface conductive layer to connect wiring boards without external cables.

Polycyclic aromatic hydrocarbon functional groups on hexagonal boron nitride improve wettability and peel strength in epoxy resin compositions.

A flexible printed wiring board uses through holes to route jumper wirings on a back surface, creating a continuous conductive path.

Etching cavities into the PCB substrate to house surface-mounted inductors below the board level, reducing module height without degrading RF performance.

High-temperature processing of a-Si layers on flexible substrates improves electrical reliability while minimizing substrate distortion.

Segmented locking bodies engage with flexible cover sidewalls to prevent detachment during removal while reducing assembly force.

Forming coplanar microelectronic pins on multilayer wiring elements using a laminated metallic layer and protective dielectric coating.

A chip inductor coil conductor pattern uses a thickness gradient to reduce AC resistance at high frequencies.

Alternating semiconductor device mounting directions on a multilayer substrate reduces line density and equalizes lengths to prevent interference.

A compact optical transceiver stacks two sub-assemblies with distinct frame heights to maintain fiber bending radius and minimize signal loss.

Controlled plating film thickness in through hole expansion parts prevents void formation and improves adhesion strength between conductor layers.

Inkjet printing polydopamine nanoparticles on flexible substrates enables site-selective electroless copper deposition at low temperatures.

Integrating gate and source driving chips on flexible printed circuit boards to reduce display bezel width.

Symmetric terminal patterns on a single substrate allow series and parallel connections, reducing production costs and management complexity.

A hybrid circuit board structure combines resin-coated copper and prepreg layers to minimize warpage in high-frequency applications.

A resin composition blends polyphenylene ether and butadiene polymers to achieve high adhesion strength on low-roughness copper foils.

Irregular heat transfer holes in a printed circuit board lower thermal resistance between components and the base.

Segmented planar composite PCB stators reduce eddy current losses and temperature gradients by isolating conductive regions with dielectric material.

A wiring board uses a through-hole conductor to connect electrical layers across an opening edge.

Pogo pins replace cables and connectors between LCD modules and main boards, reducing terminal thickness while maintaining electrical connectivity.

Shape memory alloy washers adjust heat sink pressure on BGA devices to prevent ball damage during handling while maintaining thermal performance.

A wiring substrate uses a composite copper alloy seed layer and electrolytic plating on a glass core to form stable conductor circuits.

Parallel LED strings with series fuses isolate defective components to prevent overheating and maintain reliable light emission.

Integrated flexible printed wiring board heater merges heating and conductive foils onto a single base film.

A Rogowski coil formed within a glass substrate enables rapid current measurement through electromagnetic induction.

A multilayered thermal coating deposits a copper layer on a nonpolar insulation film to conduct heat away from power components.

Specifying copper foil crystal grain size and palladium content prevents abnormal growth, eliminating inspection errors and via hole peeling.

Inclined power supply terminal electrodes align with flexible printed board contacts, reducing pressure bonding area discrepancies and luminance gaps.

A redundant electronic circuit maintains electrical continuity through parallel branches between nodes.

Interlayer conductors feature variable wall thickness to minimize surface unevenness across varying hole densities.