Transformer Integrated PCB with Thick Surface Primary Winding

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Solution Overview

Problem

Existing transformer integrated type printed circuit boards face challenges in efficiently managing large electric currents while minimizing the occupied area, as increasing the width of primary winding wires to accommodate higher currents results in poor fitment between core leg portions.

Innovation Solution

The transformer integrated type printed circuit board design features a primary winding wire with a larger width and thickness disposed in the surface layer, and a secondary winding wire with a smaller width and thickness in the internal layer, both wound between core leg portions, with through-holes connecting them, allowing for stable current flow while maintaining a compact footprint.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the width of the primary winding wire is increased to accommodate larger electric current, then the current carrying capacity is improved, but the occupied area on the printed circuit board becomes large and the wire does not fit between the core leg portions

Engineering Contradiction:
Improvecurrent carrying capacityVSAvoidoccupied area of winding wire
Core Design Contradiction:
ReliabilityVSArea of moving object

Solution Approach 1:

The patent transitions the primary winding wire from a two-dimensional planar trace to a three-dimensional structure by forming it as a thick wire extending in the thickness direction of the printed circuit board. This dimensional change allows the wire to achieve high current carrying capacity through increased cross-sectional area in the thickness direction rather than increasing width in the planar direction, thereby solving the contradiction between current capacity and occupied area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the primary winding wire is made thick to reduce occupied area, then the current carrying capacity is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvecurrent carrying capacityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the primary winding wire formation process with the existing printed circuit board manufacturing process. The thick wire is formed as an integral part of the PCB structure through copper plating and lamination processes that are already standard in PCB fabrication, thereby achieving complex three-dimensional wire structures without significantly increasing manufacturing complexity or cost.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables stable high-current flow through the primary winding wire while keeping the occupied area small, and stable low-current flow through the secondary winding wire, effectively miniaturizing the transformer without increasing manufacturing complexity or cost.

Implementation Method 1

The core forms a magnetic path of a magnetic flux which interlinks with the winding wire

Methodology Applied
Scientific EffectMagnetic flux: Magnetic Field

Implementation Method 2

a core of the transformer or the choke coil is used as a pair of upper and lower cores... The winding wire is wound around a middle leg portion to be fit into between the middle leg portion and left and right leg portions

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS10405429B2Transformer integrated type printed circuit board
Publication Date: 2019.09.03 OMRON CORP
  • US10405429B2 patent drawing
  • US10405429B2 patent drawing
  • US10405429B2 patent drawing

AI summary

A transformer integrated type printed circuit board includes: a transformer including a core, a primary winding wire, and a secondary winding wire; and a printed circuit board including a surface layer and an internal layer in which wiring patterns are respectively formed, and having a plurality of insertion portions into which a plurality of leg portions of the core are respectively inserted. The primary winding wire is disposed in the surface layer of the printed circuit board so as to be wound between the leg portions, and the secondary winding wire is disposed in the internal layer of the printed circuit board so as to be wound between the leg portions. The primary winding wire is small in number of windings, is large in width, and is large in thickness, in comparison with the secondary winding wire.