Optical Transceiver Sub-Assembly Stacking for Signal Attenuation
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Solution Overview
Problem
Existing optical transceivers face challenges in efficiently accommodating multiple optical sub-assemblies within a compact housing while maintaining low optical signal attenuation and effective heat dissipation, which affects data capacity and size reduction.
Innovation Solution
The optical transceiver design includes two optical sub-assemblies with a unique frame configuration that allows for efficient placement and overlap along a single direction, utilizing a higher frame height for one sub-assembly to increase the bending radius of optical fibers and reduce attenuation, along with heat dissipation sheets for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple optical sub-assemblies are accommodated in a compact housing, then the data capacity is enhanced and size is reduced, but the optical signal attenuation increases and heat dissipation becomes difficult
Solution Approach 1:
The patent arranges optical sub-assemblies in a three-dimensional configuration within the housing, utilizing vertical stacking and lateral positioning to maximize space utilization. The first and second optical sub-assemblies are positioned at different locations within the housing, with optical fibers routed through specific paths to connect them to the optical receptacle, thereby reducing signal attenuation while maintaining compact form factor.
Solution Approach 2:
The patent introduces heat dissipation sheets as intermediary components between the optical sub-assemblies and the housing walls. These sheets facilitate thermal management by conducting heat away from the optical devices, preventing overheating in the compact configuration. Additionally, the housing structure itself acts as an intermediary to route optical fibers with adequate bending radius, reducing signal attenuation.
2Volume of moving object
If optical sub-assemblies are placed closer together to reduce size, then the transceiver volume is reduced, but the optical fiber bending radius decreases causing increased attenuation
Solution Approach 1:
The patent utilizes three-dimensional space within the housing to route optical fibers, allowing them to maintain adequate bending radius even when optical sub-assemblies are positioned closely. The housing structure provides dedicated fiber routing paths that extend from the optical receptacle to each sub-assembly, preventing excessive bending in the compact configuration.
Solution Approach 2:
The patent employs multiple optical sub-assemblies (first and second optical sub-assemblies) with similar structures, each containing optical devices and connected to the optical receptacle through dedicated optical fibers. This modular approach allows for standardized fiber routing that maintains reliable signal transmission while enabling compact arrangement through systematic replication of proven designs.
3Quantity of substance
If multiple optical sub-assemblies are installed on a circuit board, then the data capacity is increased, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the optical transceiver into distinct modular components: the housing, the optical receptacle, multiple optical sub-assemblies, and heat dissipation sheets. Each optical sub-assembly is a self-contained module that can be independently positioned and connected to the optical receptacle. This segmentation simplifies the overall structure by eliminating the need for complex integration on a single circuit board, while still enabling multiple optical channels for high data capacity.
Solution Approach 2:
The housing serves multiple functions simultaneously: it provides structural support, routes optical fibers to maintain adequate bending radius, and incorporates heat dissipation sheets for thermal management. The optical receptacle acts as a universal interface that can accommodate multiple optical sub-assemblies with standardized connections. This multi-functionality reduces device complexity by consolidating several functions into fewer components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances data capacity, reduces the transceiver's size, and minimizes optical signal loss by optimizing the placement and height of optical sub-assemblies, while using common components to lower costs.
Implementation Method 1
an optical device configured to perform an conversion between the electrical signal and an optical signal
Implementation Method 2
heat dissipation sheets for thermal management
Data Source
AI summary
An optical transceiver according to an embodiment includes an optical receptacle, two optical sub-assemblies, and a circuit board having a upper surface, on which the optical sub-assembly on the rear side is installed on the opposite side of an external connector to the optical receptacle on the upper surface and the optical sub-assembly on the front side is installed between the optical receptacle and the optical sub-assembly on the rear side on the upper surface. Each of the optical sub-assemblies includes an optical sub-assembly substrate on which an optical device is mounted, a lens part that covers the optical device and that is optically coupled to the optical receptacle, and a frame. A part of the frame of the optical sub-assembly on the front side is pressed by the optical sub-assembly substrate of the optical sub-assembly on the rear side toward the circuit board.