Photosensitive Resin Composition for High-Resolution Semiconductor Patterns
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Solution Overview
Problem
Existing polyimide-containing photosensitive resin compositions face challenges in forming patterns with high resolution, wide light exposure margins, and rectangular cross-sectional shapes, which are essential for preventing defective conduction in semiconductor devices and circuit boards due to limitations in heat resistance and pattern formation precision.
Innovation Solution
A photosensitive resin composition comprising a polyimide with terminal alkali soluble groups, a monomer, a thermally cross-linkable compound, a photopolymerization initiator, and a polymerization inhibitor with a naphthalene or anthracene skeleton, which allows for stable pattern formation with a wide light exposure margin and excellent heat resistance after heat curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a polyimide-containing photosensitive resin composition is used for pattern processing, then heat resistance is improved, but light exposure margin becomes narrow and rectangular cross-sectional shape cannot be obtained
Solution Approach 1:
The patent uses a composite resin composition containing polyimide (30-70 wt%), vinyl monomer (10-40 wt%), and carboxylic acid group-containing compound (5-20 wt%). This composite formulation combines the heat resistance of polyimide with the reactivity of vinyl monomers and the crosslinking capability of carboxylic acid compounds, achieving both high heat resistance (Tg ≥ 200°C) and excellent pattern formation with rectangular cross-sections and wide light exposure margins
Solution Approach 2:
The patent optimizes the molecular weight of polyimide (5,000-100,000), the ratio of vinyl monomer to carboxylic acid group-containing compound (0.1-10:1), and the content of each component to achieve the desired balance between heat resistance and pattern formation quality. By controlling these parameters, the resin forms patterns with rectangular cross-sections while maintaining Tg ≥ 200°C
2Manufacturing precision
If high resolution pattern is formed, then manufacturing precision is improved, but light exposure margin becomes narrow
Solution Approach 1:
The patent uses vinyl monomers with specific molecular weights (50-10,000) and carboxylic acid group-containing compounds with controlled molecular weights (100-10,000) to optimize the curing characteristics. This parameter optimization enables the formation of high-resolution patterns (line widths ≥ 10 μm) while maintaining a wide light exposure margin, allowing flexible process control
3Manufacturing precision
If rectangular cross-sectional shape is obtained, then manufacturing precision is improved, but process complexity increases
Solution Approach 1:
The patent achieves rectangular cross-sectional shapes by controlling the ratio of vinyl monomer to carboxylic acid group-containing compound (0.1-10:1) and optimizing the curing conditions. This straightforward compositional control, without requiring complex multi-step processes or specialized equipment, enables precise cross-sectional shape control while maintaining process simplicity
Solution Approach 2:
The resin composition self-adjusts to form rectangular cross-sectional patterns through the controlled reaction between vinyl monomers and carboxylic acid group-containing compounds during curing. The chemical composition and reaction kinetics inherently guide the pattern formation process, eliminating the need for complex external control mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high-resolution patterns with rectangular cross-sectional shapes and excellent electrical, mechanical, and heat-resistant insulating films, suitable for semiconductor devices and circuit board applications, enhancing the reliability and performance of semiconductor devices and circuit boards.
Implementation Method 1
a photopolymerization initiator
Implementation Method 2
it has been found that a polymerization inhibitor having a naphthalene skeleton or an anthracene skeleton, containing at least one hydroxyl group, alkoxy group, aryloxy group, and/or aralkyloxy group attached to the naphthalene skeleton or the anthracene skeleton
Implementation Method 3
a thermally cross-linkable compound
Implementation Method 4
Polyimides have excellent electrical and mechanical characteristics and a high heat resistance of 300° C. or more
Data Source
AI summary
A photosensitive resin composition contains (a) a polyimide which has, at a terminal of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, (b) a monomer, (c) a thermally crosslinkable compound, (d) a photopolymerization initiator and (e) a polymerization inhibitor, wherein the polymerization inhibitor (e) is a compound obtained by adding at least one hydroxyl group, alkoxy group, aryloxy group or aralkyloxy group to a naphthalene skeleton or an anthracene skeleton of a compound having a naphthalene skeleton or an anthracene skeleton.