Heat Dissipation Substrate With Resin-Filled Through-Hole
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Solution Overview
Problem
Conventional heat dissipation substrates face challenges in ensuring stable adhesion and cost-effectiveness, particularly when using manual methods for inserting dissipation materials, which can lead to adhesion degradation under high temperatures and increased costs.
Innovation Solution
A heat dissipation substrate design featuring a base substrate with a through-hole, a heat dissipation member inserted into the hole, and a thermally conductive resin covering the member's side surfaces without gaps, ensuring the metal layer and electrically conductive path are on the same plane, facilitating efficient heat dissipation and stable adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a dissipation material is inserted into the substrate and fixed by applying pressure to cause plastic deformation, then the dissipation material can be secured in the substrate, but the adhesion degrades when exposed to high heat due to space generation between the dissipation material and substrate inner wall
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the dissipation material and the substrate inner wall. This resin layer fills the spaces and gaps that would otherwise form during high-temperature exposure, maintaining continuous contact and adhesion. The resin acts as a compliant mediator that accommodates thermal expansion differences while preserving the bonding interface.
Solution Approach 2:
The physical state and properties of the resin layer are utilized to adapt to high-temperature conditions. The resin is selected or designed to maintain its filling and bonding capabilities at elevated temperatures, changing its physical parameters (such as viscosity, expansion coefficient) to match the operational conditions and prevent space generation between components.
2Ease of manufacture
If manual methods are used to insert and fix the dissipation material, then the dissipation material can be positioned in the substrate, but manufacturing cost increases
Solution Approach 1:
The resin layer is applied to the substrate or dissipation material before the insertion process. This preliminary action prepares the interface in advance, allowing for automated or semi-automated insertion without requiring complex manual manipulation during assembly. The pre-applied resin simplifies the insertion process and enables more efficient manufacturing methods.
3Ease of manufacture
If plating liquid enters the space between the substrate inner wall and dissipation material, then circuit patterns can be formed, but high heat exposure causes the plating liquid residue to volatilize and generate space, degrading adhesion
Solution Approach 1:
The resin layer serves as an intermediary barrier that prevents plating liquid from penetrating into the critical interface space between the substrate and dissipation material. By blocking the plating liquid access to this space, the resin prevents residue formation and subsequent volatilization issues during high-temperature operation, while still allowing plating processes to proceed on other surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the stability of the heat dissipation substrate by preventing adhesion degradation at high temperatures and reduces manufacturing costs through efficient heat dissipation and improved connection stability.
Implementation Method 1
a thermally conductive resin constituent covering a side surface of the heat dissipation member, the thermally conductive resin constituent being present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface
Data Source
AI summary
A heat dissipation substrate is disclosed including a base substrate having a first surface and a second surface, an electrically conductive path formed on the first surface, a through-hole penetrating from the first surface to the second surface, a heat dissipation member that is inserted into the through-hole and at least a part of which projects from the first surface, a thermally conductive resin constituent, covering a side surface of the heat dissipation member, that is present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface, and a metal layer covering the heat dissipation member projecting from the first surface, in which an outer surface of the metal layer and an outer surface of the electrically conductive path are disposed on substantially the same plane.