Resin Composition for Low-Roughness Copper Foil Adhesion
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Solution Overview
Problem
High-frequency printed wiring boards face challenges in achieving low transmission loss due to low adhesion between low-roughness copper foils and resin layers, which leads to peeling issues and reduced adhesion strength.
Innovation Solution
A resin composition is developed, blending a polymer with a polyphenylene ether and butadiene backbone with polymers having styrene butadiene and cycloolefin backbones, creating a micro-controlled phase-separated structure that enhances adhesion, dielectric properties, and heat resistance, while maintaining low water absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a low-roughness copper foil is used to reduce transmission loss, then dielectric loss is reduced, but adhesion to the resin layer deteriorates
Solution Approach 1:
The invention changes the chemical composition parameters of the resin layer by incorporating specific polymers (polymer (a) with polyphenylene ether and butadiene backbone, and polymer (b) with styrene-butadiene or cycloolefin backbone) in controlled ratios. This compositional parameter change enables the resin to achieve both low dielectric loss tangent (≤0.004 at 10 GHz) and high adhesion strength (≥0.6 kgf/cm²) simultaneously, resolving the contradiction between using low-roughness copper foil for reduced transmission loss and maintaining adequate adhesion.
2Loss of energy
If the resin layer has excellent dielectric properties with low dielectric loss tangent, then transmission quality is improved, but adhesion to copper foil deteriorates
Solution Approach 1:
The invention creates a composite resin material system combining polymer (a) with polyphenylene ether and butadiene backbone and polymer (b) with styrene-butadiene or cycloolefin backbone. This composite material structure achieves synergistic effects where the polyphenylene ether component provides low dielectric loss while the butadiene-containing components provide adhesion functionality, thereby simultaneously achieving excellent dielectric properties and high adhesion strength.
Solution Approach 2:
The invention optimizes the compositional ratio parameters between polymer (a) and polymer (b) within specific ranges (polymer (a): 10-60 parts by weight, polymer (b): 40-90 parts by weight based on total resin composition). This parameter optimization enables the resin layer to achieve both low dielectric loss tangent (≤0.004 at 10 GHz) and high adhesion strength (≥0.6 kgf/cm²), resolving the contradiction between dielectric performance and adhesion.
3Manufacturing precision
If the copper foil surface is made smooth to reduce transmission loss, then signal quality is improved, but adhesion to the resin layer deteriorates
Solution Approach 1:
The invention changes the chemical composition parameters of the resin layer by incorporating specific polymers (polymer (a) with polyphenylene ether and butadiene backbone, and polymer (b) with styrene-butadiene or cycloolefin backbone) in controlled ratios. This compositional parameter change enables the resin to achieve both low dielectric loss tangent (≤0.004 at 10 GHz) and high adhesion strength (≥0.6 kgf/cm²) simultaneously, resolving the contradiction between using low-roughness copper foil for reduced transmission loss and maintaining adequate adhesion.
Data Source
AI summary
There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).