Embedded Component PCB via Conductive Paste Alignment
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Solution Overview
Problem
The existing methods for manufacturing printed circuit boards with embedded components face challenges in achieving accurate alignment between conductive vias and electronic components, leading to inefficiencies and increased costs due to the need for precise alignment machinery.
Innovation Solution
The method involves forming conductive vias and conductive paste blocks on a double-sided copper clad lamination, allowing electronic components to be directly connected to the paste blocks without requiring precise alignment, thereby eliminating the need for expensive alignment machinery and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional methods are used to manufacture printed circuit boards with embedded components, then alignment accuracy between conductive vias and electronic components can be improved, but manufacturing complexity and cost increase due to requiring precise alignment machinery
Solution Approach 1:
The patent applies preliminary action by pre-forming conductive paste blocks at specific locations on the copper clad lamination before placing electronic components. These paste blocks serve as predetermined alignment references that eliminate the need for complex alignment machinery during component placement, thereby reducing manufacturing complexity while maintaining positioning accuracy
Solution Approach 2:
The conductive paste blocks act as an intermediary element between the conductive vias and the electronic component electrodes. Instead of directly aligning components with vias requiring precision machinery, the paste blocks serve as a mediator that simplifies the alignment process while ensuring proper electrical connection paths are established
2Manufacturing precision
If traditional methods with precise alignment machinery are used, then alignment accuracy between conductive vias and electronic components is improved, but manufacturing cost increases
Solution Approach 1:
The conductive paste blocks are simple, inexpensive materials applied in thin layers that serve their alignment and electrical connection function effectively. These paste blocks replace expensive alignment machinery, demonstrating the principle of using cheap materials to substitute for costly equipment while achieving the desired manufacturing precision
Solution Approach 2:
The paste blocks serve as an intermediary that eliminates the need for expensive precision alignment equipment. By introducing this simple mediating element, the patent achieves accurate component positioning through a low-cost process rather than relying on costly machinery
3Productivity
If conductive paste blocks are formed before component placement, then manufacturing efficiency is improved, but additional process steps are required
Solution Approach 1:
The patent merges multiple functions into the conductive paste blocks: they serve as alignment references, provide electrical conductivity for signal transmission, and create bonding surfaces for component attachment. By combining these functions into a single element, the process becomes more efficient despite adding a formation step, as it eliminates the need for separate alignment and connection operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency and reduces costs by eliminating the need for precise alignment, while ensuring reliable electrical connections between components and the printed circuit board.
Implementation Method 1
conductive paste blocks (15), each covering and being electrically connected to one end of the first conductive vias (11), respectively
Implementation Method 2
The electronic component (16) is electrically connected to the first conductive vias (11) through the conductive paste blocks (15)
Data Source
AI summary
A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer.