Rogowski Coil Integrated in Glass Substrate for Fast Short Circuit Detection
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Solution Overview
Problem
Existing power semiconductor devices face challenges in detecting short circuits effectively, particularly in differentiating between short circuit currents and overcurrents, which can lead to electrical and thermal destruction if not detected in time.
Innovation Solution
A current measurement device is formed using a glass substrate with through-vias and conductive tracks that create a coil structure, allowing for accurate and rapid current measurement through induced magnetic fields, enabling early detection of short circuits and preventing device damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If driver circuit detects unexpected rise in output voltage to identify short circuit, then short circuit detection capability is improved, but detection time increases and reliability decreases due to inability to differentiate between short circuit current and overcurrent
Solution Approach 1:
The patent replaces voltage-based detection (electrical field measurement) with current-based detection using a Rogowski coil (magnetic field measurement). The coil measures the magnetic field generated by the current flowing through the semiconductor device, enabling direct current measurement without voltage rise detection. This substitution provides faster and more reliable short circuit detection by directly measuring the parameter of interest (current) rather than inferring it from voltage changes.
2Measurement precision
If shunt arrangement is used for current measurement, then current measurement capability is improved, but measurement accuracy deteriorates because it does not accurately reflect the parameter of interest
Solution Approach 1:
The patent introduces a Rogowski coil as an intermediary sensing element that measures the magnetic field generated by the current in the semiconductor device. Instead of directly measuring voltage drops (shunt method) or relying on device output characteristics, the coil acts as a non-intrusive mediator that captures the magnetic field signature of the current, providing accurate current measurement without affecting the device operation or requiring direct electrical contact with the device terminals.
3Ease of manufacture
If conventional current measurement methods are used, then integration is simplified, but parasitic effects increase and measurement fidelity decreases
Solution Approach 1:
The patent extracts the current sensing function from the power semiconductor device itself and places it in a separate Rogowski coil structure. The coil is positioned to sense the magnetic field around the device current path without being electrically connected to the device circuitry. This separation eliminates parasitic inductance and resistance that would be introduced by integrating sensing elements directly into the power device, while still enabling accurate current measurement for protection purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The current measurement device provides reliable and fast short circuit detection, minimizing damage to semiconductor devices by enabling timely disablement and integrating seamlessly into power modules with minimal parasitic effects.
Implementation Method 1
forming the through-vias and forming the detachment features by applying radiation to the glass substrate... applying laser energy to the glass substrate to form a plurality of first laser-treated regions
Implementation Method 2
A current measurement device is formed using a glass substrate with through-vias and conductive tracks that create a coil structure, allowing for accurate and rapid current measurement through induced magnetic fields
Data Source
AI summary
A method of forming a current measurement device includes providing a glass substrate having first and second substantially planar surfaces that are opposite one another, forming a plurality of through-vias in the glass substrate that each extend between the first and second substantially planar surfaces, and forming conductive tracks on the glass substrate that connect adjacent ones of the through-vias together. Forming the plurality of through-vias includes applying radiation to the glass substrate, and the conductive tracks and the through-vias collectively form a coil structure in the glass substrate.