Display Device Adhesive Configuration for Bending Stress Management
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Solution Overview
Problem
The existing display devices face defects during the bending process of the bezel area, which affects the structural integrity and functionality of electronic devices like smartphones and smart televisions.
Innovation Solution
A display device design that includes a window, an input sensing panel, a display panel with non-bending and bending areas, a stress control film, and adhesive members to manage stress and prevent defects during the bending process, featuring a specific configuration of adhesive members and circuit boards to distribute stress evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the bezel area is bent to provide a slim bezel, then the device achieves a thinner profile and modern design, but defects occur during the bending process affecting structural integrity
Solution Approach 1:
The display device is divided into bending and non-bending areas, with the bezel area specifically segmented for bending while the display panel remains flat. This segmentation allows the bezel to achieve a thin profile through bending without compromising the structural integrity of the display panel, as each zone is optimized for its specific function.
Solution Approach 2:
Different regions of the display device are assigned different mechanical properties: the bezel area is designed to be flexible for bending, while the display panel area maintains rigidity for structural support. This local differentiation of material properties and structural characteristics enables the bezel to bend into a slim profile while the display panel preserves its structural integrity and prevents defects during the bending process.
2Stability of the object's composition
If adhesive members are used to bond layers during bending, then structural stability is maintained, but stress concentration and delamination may occur
Solution Approach 1:
The adhesive members are strategically positioned in non-bending areas, separating the bonding function from the bending zone. This segmentation ensures that adhesive bonds are established in regions that will not undergo deformation, preventing stress concentration at adhesive interfaces while maintaining layer stability in the bonded regions.
Solution Approach 2:
The adhesive bonding function is extracted from the bending area and relocated to non-bending areas. By removing adhesive members from zones subjected to mechanical stress during bending, the design eliminates the harmful effect of stress concentration at adhesive interfaces, while still achieving stable layer bonding in regions where no deformation occurs.
3Adaptability or versatility
If circuit boards are connected to multiple panels during bending, then functionality is maintained, but lifting and delamination defects occur
Solution Approach 1:
The circuit board connection structure is segmented into bending and non-bending connection zones. Connection terminals and bonding pads are positioned in non-bending areas, allowing electrical functionality to be maintained through rigid connections in stable regions, while the bending area remains free of precision-critical connections that would be susceptible to deformation-induced defects.
Solution Approach 2:
Different regions of the circuit board assembly are assigned different functional roles: non-bending areas house precision-critical connection terminals and bonding pads that require high assembly precision, while bending areas contain only flexible connections or no connections. This local differentiation ensures that electrical functionality is maintained through secure bonding in stable regions without introducing lifting or delamination defects in bending zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces defects around the bending area, enhancing the structural integrity and reliability of electronic devices by effectively managing stress and preventing delamination and lifting phenomena.
Implementation Method 1
a first adhesive member bonding the optical sheet to the input sensing panel
Implementation Method 2
a stress control film coupled to a top surface of the display panel, the stress control film overlapping the bending area
Data Source
AI summary
A display device may include a window, an input sensing panel, first to third connection circuit boards, an optical sheet, a display panel, a stress control film, and a first adhesive member configured to couple the optical sheet and the input sensing panel. On a plane, the first adhesive member may include an inner portion overlapping the optical sheet and an outer portion extending from the inner portion to the outside and non-overlapping the optical sheet while overlapping the stress control film. A first portion of an edge of the first adhesive member defines a recessed area that is recessed toward a center area of the inner portion so that a partial area of the optical sheet is exposed.