PCB Cavity for Embedded Inductor Height Reduction
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Solution Overview
Problem
The height of electronic components, particularly inductors, limits the miniaturization of electronic products, as they are typically the tallest components on printed circuit boards (PCBs), making it challenging to reduce the overall module height without compromising performance.
Innovation Solution
Forming cavities on the PCB to house the tallest components, using L-shaped terminals with reduced pad thickness and specific solder profiles, and employing flux print or low metal content solder paste to minimize the module's height while maintaining or enhancing radio frequency (RF) performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If inductor height is reduced to decrease module height, then module height is reduced, but RF performance deteriorates
Solution Approach 1:
The patent introduces cavities that extend vertically into the PCB substrate, creating a third-dimensional space to accommodate tall inductors. This allows the inductors to be positioned below the PCB surface level, reducing the overall module height while maintaining the inductors' original height and RF performance characteristics.
Solution Approach 2:
The inductors are nested within the cavities formed in the PCB substrate. The cavities are etched into the substrate to create recessed spaces that house the inductors, allowing the inductors to be embedded within the PCB structure rather than mounting on the surface, thereby reducing module height without compromising inductor performance.
2Length of stationary object
If component height is reduced to decrease module height, then module height is reduced, but component performance is compromised
Solution Approach 1:
Instead of reducing component height, the patent utilizes the vertical dimension of the PCB substrate by creating cavities that extend downward. This allows full-height components to be positioned in the z-direction below the surface, maintaining their performance while reducing the overall module height envelope.
Solution Approach 2:
The PCB substrate is segmented into different levels by creating cavities at specific locations. This segmentation allows certain areas of the PCB to have reduced height (where cavities are formed) while other areas maintain full height, enabling selective placement of tall components in the cavities without affecting overall component performance.
3Reliability
If conventional mounting methods are used with tall inductors, then RF performance is maintained, but module height increases
Solution Approach 1:
Tall inductors are nested within cavities etched into the PCB substrate. The cavities provide a recessed space that accommodates the full height of the inductors, allowing them to be embedded within the PCB structure. This maintains optimal inductor performance while reducing the overall module height by eliminating the need for additional clearance above the inductors.
Solution Approach 2:
The solution moves the inductors from a surface-mounted configuration into the vertical dimension of the PCB substrate. By etching cavities that extend into the substrate thickness, the inductors are positioned in the z-direction below the PCB surface, maintaining their RF performance while reducing the module's overall height envelope.
Data Source
AI summary
An electronic device includes a printed circuit board (PCB) defining a cavity, a first component pad of the PCB positioned outside the cavity, and a second component pad of the PCB positioned on a bottom surface of the cavity. The first component pad has a first thickness, and the second component pad has a second thickness that is less than the first thickness of the first component pad. An electronic component, such as a surface mounted technology (SMT) component, is mounted to the second component pad within the cavity.