Single-Layer LED Circuit Board Design for Uniform Channel Resistance
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Solution Overview
Problem
Conventional circuit boards for light-emitting diode (LED) assemblies face issues with uniform channel resistance and electrical connection reliability due to multiple landing pads and wirings, leading to suboptimal color reproducibility and luminance in LCD devices.
Innovation Solution
A single-layered circuit board design with conductive circuitry on one surface, featuring LED landing pads, common, and individual wirings, where the insulating layer covers the wirings and has high reflectance, and dimming zones are defined to improve electrical connection reliability and luminance efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple landing pads and wirings are disposed on the circuit board, then LED mounting capability is improved, but channel resistance uniformity deteriorates
Solution Approach 1:
The patent merges multiple circuit layers into a single planar circuit layer, combining the functions of multiple landing pads and wirings that were previously distributed across different layers. This single planar structure ensures uniform channel resistance by eliminating the need for via connections between layers, while still providing sufficient LED mounting capability through an increased number of landing pads within the same layer.
2Productivity
If wirings are disposed on both surfaces of the circuit board, then wiring capacity is improved, but electrical connection reliability deteriorates
Solution Approach 1:
The patent transitions from a three-dimensional multi-layer wiring structure to a two-dimensional single-layer wiring structure. By expanding the wiring capacity within the planar dimension rather than adding layers in the vertical dimension, the invention maintains adequate wiring capacity while eliminating via holes and contacts, thereby improving electrical connection reliability.
3Adaptability or versatility
If additional via holes or contacts are used, then circuit connection capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the via holes and contacts from the circuit board structure, removing the need for additional manufacturing steps required to create these vertical connections. The circuit connection capability is maintained through an optimized single-layer wiring design that provides sufficient connectivity without requiring complex multi-layer via structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents increased resistance and enhances electrical connection reliability, enabling high color reproducibility and luminance by distributing circuit wirings on one surface, reducing the need for additional via connections and maintaining a thin profile.
Implementation Method 1
the insulating layer includes a resist layer having a reflectance of 80% or more with respect to a visible light
Data Source
AI summary
A circuit board for a light-emitting diode assembly according to an embodiment includes a substrate layer having a first surface and a second surface facing each other, a conductive circuit layer disposed on the first surface of the substrate layer and having a single-layered structure, and an insulating layer formed on the first surface of the substrate layer to cover the conductive circuit layer. Channel resistance, luminous efficiency and luminous uniformity can be improved through a side connection of a dimming zone while vias or contacts are omitted.