Semiconductor Module Asymmetric Mounting for Line Density Reduction
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Solution Overview
Problem
Existing semiconductor modules face issues with increased line density due to parallel connections of semiconductor devices and insufficient mounting margins, particularly when integrating memory devices and register buffers, leading to complex line layouts and potential interference.
Innovation Solution
A semiconductor module design where DRAMs and register buffers are mounted on both surfaces of a multilayer substrate with diagonal connections via conductors, optimizing line layout to reduce density and equalize line lengths, and ensuring sufficient mounting margins by aligning long sides of DRAMs with the substrate's long direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If semiconductor devices are arranged in two rows along the long side direction with the same mounting direction in each row, then line density is reduced and line length is equalized, but address signal lines must meander in narrow space causing increased line density
Solution Approach 1:
The patent applies asymmetry by alternating the mounting directions of semiconductor devices in adjacent columns. Specifically, devices in odd-numbered columns are mounted in a first direction while devices in even-numbered columns are mounted in a second direction that differs by 90 degrees. This asymmetric arrangement allows signal lines to connect to devices in both directions, eliminating the need for meandering lines and reducing line density while maintaining equal line lengths.
2Quantity of substance
If a mixture of horizontal and vertical semiconductor devices are mounted to reduce line density, then line density is reduced, but mounting margins become insufficient in the short side direction
Solution Approach 1:
The patent applies local quality by making the mounting direction of semiconductor devices location-dependent. Devices in odd-numbered columns are mounted in a first direction while devices in even-numbered columns are mounted in a second direction. This localized variation in mounting direction optimizes line density in the column direction while preserving sufficient mounting margins in the row direction, as all devices in the same row maintain consistent spacing.
Data Source
Figure 1A~1B
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AI summary
Disclosed herein is a semiconductor module that includes a module substrate and a plurality of semiconductor devices mounted on the module substrate. Among the semiconductor devices, two of the semiconductor devices adjacent in a first direction differ in a mounting direction by 180°. Among the semiconductor devices, two of the semiconductor devices adjacent in a second direction perpendicular to the first direction differing in a mounting direction by 180°.