Wiring Substrate Interlayer Conductor Thickness Profile

The patent applies local quality by making the interlayer conductor walls have non-uniform thickness along their length. Specifically, the wall thickness is increased at the end parts (near the first and second conductor layers) and decreased at the center parts. This local variation in thickness allows the conductor to provide reliable electrical connection at the interfaces while maintaining smoother surfaces in the dense regions, thus resolving the contradiction between electrical connection reliability and surface unevenness.

The invention applies local quality by varying the wall thickness of interlayer conductors in different regions. In high-density regions where through holes are closely spaced, the reduced wall thickness at center parts creates a smoother surface profile. This local adaptation allows the substrate to maintain good electrical resistance characteristics while providing a more uniform surface for component mounting, thus resolving the contradiction between electrical resistance and manufacturing ease.

The patent applies parameter changes by modifying the wall thickness parameter of interlayer conductors as a function of position. Instead of maintaining a constant wall thickness, the thickness parameter is varied along the length of the conductor, with thicker sections at the ends and thinner sections at the center. This parameter variation allows the system to achieve consistent electrical resistance characteristics across regions with different through hole densities while remaining manufacturable through controlled deposition processes.