Chip Level EMI Shielding Structure Using Conformal Ground Layer
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Solution Overview
Problem
Conventional chip structures and EMI shielding designs are inadequate for modern thinner electronic products, as they fail to effectively suppress electromagnetic interference while maintaining the necessary electrical, mechanical, and thermal stability.
Innovation Solution
A chip-level EMI shielding structure is developed, featuring a ground layer and connection structures on the rear and lateral sides of a semiconductor substrate, with a redistribution layer and metal conductor lines to form a conformal shielding, eliminating the need for a printed circuit board and minimizing chip size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional chip structure with metal layer on substrate is used, then EMI shielding is provided, but chip size and volume increase
Solution Approach 1:
The patent transitions from planar EMI shielding (metal layers on substrate surfaces) to three-dimensional conformal shielding that wraps around the chip edges and lateral surfaces. This dimensional expansion allows comprehensive EMI protection while maintaining compact chip footprint by utilizing vertical and lateral space efficiently.
Solution Approach 2:
The shielding structure applies different geometries to different regions: planar metal layers on top/bottom surfaces, vertical sidewall extensions along edges, and corner treatments. This localized adaptation optimizes EMI suppression in each region while minimizing overall volume addition, as each area receives shielding precisely where needed.
2Object-affected harmful factors
If conventional EMI shielding with separate PCB and metal layers is used, then EMI suppression is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent integrates EMI shielding functionality directly into the chip structure itself, merging what were previously separate components (chip and EMI shield) into a unified conformal shielding structure. This eliminates the need for separate PCB-based shielding implementations and reduces assembly steps.
Solution Approach 2:
The conformal shielding structure serves multiple functions simultaneously: it provides EMI shielding, defines chip boundaries, and can serve as part of the interconnection structure. This multi-functionality reduces the number of separate components and manufacturing processes needed.
3Object-affected harmful factors
If metal layer is plated on rear surface and lateral surface to form conformal shielding, then EMI suppression is improved, but manufacturing process complexity increases
Solution Approach 1:
The conformal shielding structure is formed during the chip fabrication process itself, before the chip is completed and packaged. By integrating shielding formation into the manufacturing sequence, the structure is created in advance as part of the chip, avoiding later complex assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses electromagnetic interference, reduces manufacturing costs and volume, and enhances the stability of the chip by forming a metallic shielding effect without the need for a printed circuit board, simplifying the manufacturing process.
Implementation Method 1
a ground layer and a first connection structure and a second connection structure are formed on the rear and the lateral side of the wafer to form a conformal shielding so as to suppress the electromagnetic interference
Data Source
AI summary
A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost.