Chip Module Insulation via Encircling Glue Structure
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Solution Overview
Problem
Conventional packaging methods for power amplifier chips in electronic communication devices require a dam structure that increases the size of the package, compromising portability due to the need for insulation and space reservation.
Innovation Solution
A chip module is fabricated using a substrate, chip, and passive units with a first glue structure encircling the passive units and a second glue structure covering the chip and wires, eliminating the need for a dam structure and thus minimizing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dam structure is formed to encircle the power amplifier chip for insulation protection, then the chip is appropriately packaged, but the package size increases
Solution Approach 1:
The patent extracts the insulation function from the traditional dam structure and relocates it to the glue structure. The glue structure is filled in the enclosure area to provide insulation protection for the power amplifier chip and wires, eliminating the need for a separate dam structure and reducing package size.
Solution Approach 2:
The patent merges the insulation function with the glue structure that is already present in the package. Instead of having separate dam structure and glue structure, the glue structure is designed to perform both the filling function and the insulation protection function, thereby consolidating structural elements and reducing overall package area.
2Reliability
If a dam structure is formed on the substrate, then the power amplifier chip is protected, but the substrate area must be reserved which increases package size
Solution Approach 1:
The patent extracts the protection function from the dam structure and transfers it to the glue structure. The glue structure is positioned to cover the power amplifier chip and wires within the enclosure area, providing the necessary protection without requiring additional substrate area for a dam structure.
Solution Approach 2:
The patent transitions from a two-dimensional dam structure on the substrate surface to a three-dimensional glue structure that fills the enclosure area. This vertical dimensionality change allows the protection function to be achieved without expanding the substrate footprint, as the glue structure rises vertically to provide coverage.
3Object-affected harmful factors
If wires are exposed without insulation, then antenna energy excitation occurs, but adding insulation increases package size
Solution Approach 1:
The patent makes the glue structure multi-functional by designing it to simultaneously fill the enclosure area, provide insulation protection for the wires, and eliminate the need for a separate dam structure. This universal function approach prevents antenna energy excitation while avoiding additional package size increase.
Solution Approach 2:
The glue structure serves itself by providing insulation protection as an inherent property of the material filling the enclosure area. Rather than requiring a separate insulation component, the glue structure's presence automatically provides the necessary electrical insulation, making the system self-sufficient and reducing overall complexity and size.
Data Source
AI summary
A chip module and a fabricating method thereof are provided. Firstly, a substrate is provided. Next, a chip is assembled on the substrate and electrically connected with the substrate. Afterward, a plurality of passive units is assembled on the substrate in the style of encircling the chip. Then, a first glue structure is filled between the passive units so that an encircled area is defined by the first glue structure and the passive units. Then, a second glue structure is filled in the encircled area so that the chip is covered by the second glue structure.