Chip Module Integrating Inductor Heat Sink for Power Transistor
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Solution Overview
Problem
Conventional power modules have a large footprint and inefficient heat dissipation, which limits their size reduction and increases costs due to the need for bulky heat sinks.
Innovation Solution
A chip module design that integrates a semiconductor die with a power transistor and a passive electronic component, such as an inductor, where the inductor serves both as a heat sink and an electrical component, minimizing space and improving heat dissipation and power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional power module uses separate heat sinks and electronic components, then heat dissipation can be achieved, but the footprint and overall size increase
Solution Approach 1:
The patent combines the heat sink function and electrical component function into a single integrated structure. The passive electronic component (inductor) is designed to serve dual purposes: as an electrical component in the power converter circuit and as a heat dissipation structure through its coil configuration that provides thermal pathways.
Solution Approach 2:
The passive electronic component is designed with multi-functionality, simultaneously serving as an electrical component (inductor with coil) and as a heat sink. This eliminates the need for separate heat dissipation structures, reducing the overall footprint while maintaining both electrical and thermal functions.
2Temperature
If a finned heat sink is attached to the power transistor, then heat dissipation improves, but the size and cost of the power module increase
Solution Approach 1:
The heat sink functionality is merged into the passive electronic component itself rather than being a separate attached structure. The coil configuration of the inductor provides inherent thermal pathways that eliminate the need for additional finned heat sinks, reducing both size and structural complexity.
Solution Approach 2:
The passive electronic component serves multiple functions including electrical operation as an inductor and thermal management as a heat sink, eliminating the need for separate heat dissipation structures and reducing overall device complexity.
3Adaptability or versatility
If conventional power modules use separate components for power conversion, then functionality is achieved, but the space occupied increases
Solution Approach 1:
The patent integrates multiple power conversion components (power transistor, passive electronic component with coil) into a single chip module structure. The passive component is stacked on top of the power transistor, creating a compact three-dimensional arrangement that maintains full power conversion functionality while minimizing occupied space.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement of components to a three-dimensional stacked configuration. The passive electronic component is positioned vertically above the power transistor, utilizing the vertical dimension to reduce the horizontal footprint and overall volume of the power module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chip module achieves reduced size, improved heat dissipation, and increased power density, allowing for more compact and efficient power conversion while reducing costs associated with large heat sinks.
Implementation Method 1
The passive electronic component is in thermal communication with the semiconductor die
Data Source
AI summary
A chip module is disclosed. It includes a circuit substrate, a semiconductor die comprising a power transistor mounted on the circuit substrate, and a passive electronic component. The passive electronic component is in electrical communication with the semiconductor die, and is in thermal communication with the semiconductor die.