Chip Module Manufacturing Using Reversible Jigs

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Solution Overview

Problem

There is a need for an efficient method to manufacture chip modules that include multiple electronic elements in a compact form, as existing methods struggle to minimize the size of electronic modules effectively.

Innovation Solution

The method involves using jigs with recesses to position and secure electronic elements and connectors with conductive adhesives, allowing for efficient assembly and curing of chip modules by reversing the jigs and using conductive plates to form connectors, ensuring precise placement and reduced thickness of the conductive adhesive.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If electronic elements are laminated in layers to reduce size, then the volume of the electronic module is reduced, but the manufacturing complexity increases

Engineering Contradiction:

Improvevolume of electronic moduleVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The manufacturing process is segmented into distinct stages: placing electronic elements on a first jig, placing connectors on the elements, placing additional elements on connectors, and curing adhesives. This segmentation allows each step to be optimized independently, reducing overall manufacturing complexity while maintaining the compact laminated structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Jigs are introduced as intermediary tools to facilitate the assembly process. The first jig supports electronic elements during initial assembly, and a second jig supports connectors during placement. These intermediaries simplify the manufacturing process by providing stable platforms for precise component placement in the laminated structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If connectors are placed on electronic elements using conductive adhesive, then the electrical connection is improved, but the manufacturing precision requirements increase

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidconnector placement precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The mechanical connection system is replaced with a conductive adhesive bonding system. Instead of relying on precise mechanical interlocking, the patent uses conductive adhesive to both bond connectors to electronic elements and establish electrical connections. This substitution reduces manufacturing precision requirements while improving connection reliability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding parameter from mechanical interference fit to chemical adhesive bonding. By using conductive adhesive with controlled viscosity and curing characteristics, the system achieves both mechanical attachment and electrical conductivity, reducing the precision needed for connector placement while ensuring reliable electrical connections.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If jigs with recesses are used to position components, then the positional accuracy is improved, but the device complexity increases

Engineering Contradiction:

Improvecomponent positioning accuracyVSAvoid jig complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The jigs are designed with recesses that automatically position components through self-alignment. The recesses in the first jig accommodate electronic elements, and recesses in the second jig accommodate connectors, allowing components to self-position during placement without requiring complex external positioning mechanisms. This self-service approach improves positioning accuracy while keeping the jig design relatively simple.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the efficient manufacturing of chip modules with multiple electronic elements, reducing the size of the electronic module while preventing positional shifts and thickness variations, thereby enhancing manufacturing efficiency and reliability.

Implementation Method 1

disposing a first connector on the first electronic element via a conductive adhesive; disposing a second electronic element on the first connector via a conductive adhesive

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

a step of curing the conductive adhesives

Methodology Applied

Scientific EffectCuring: Phase Change

Data Source

PatentUS11264351B2Method of manufacturing chip module

Publication Date: 2022.03.01 SHINDENGEN ELECTRIC MANUFACTURING CO LTD

AI summary

A method of manufacturing a chip module comprises a step of disposing a first electronic element 13 on a first jig 500, a step of disposing a first connector 60 on the first electronic element 13 via a conductive adhesive 5, a step of disposing a second electronic element 23 on the first connector 60 via a conductive adhesive 5, a step of disposing a second connector 70 on a second jig 550, a step of reversing the second jig in a state where the second connector 70 is fixed to the second jig 550 and disposing the second connector 70 on the second electronic element 23 via a conductive adhesive 5, and a step of curing the conductive adhesives 5.