Chip Package Cavity Carrier Eliminates Mold Compound Warpage
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Solution Overview
Problem
Embedded wafer level packages face issues such as warpage, deformation, outgassing, poor thermal conductivity, and contact difficulties due to mold compound problems during temperature cycling and IC lead contacts.
Innovation Solution
A method for manufacturing a chip package that eliminates the need for mold compound by using a metal sheet or foil with structured cavities, where integrated circuit chips are arranged in these cavities and adhered using an etch stop layer and adhesion layer, allowing for precise and planar placement without mold material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mold compound is used in embedded wafer level packaging, then chip encapsulation and protection are achieved, but warpage, deformation, and poor thermal conductivity occur during temperature cycling
Solution Approach 1:
The patent removes the mold compound from the packaging structure entirely, replacing it with a cavity-based carrier structure. The carrier has recesses that hold the chips, eliminating the mold compound that causes warpage and deformation during temperature cycling while still providing protection and structural integrity.
Solution Approach 2:
The patent uses a composite structure combining the carrier material with thermal interface material or solder material in the recesses, creating a hybrid packaging solution that provides both mechanical support and excellent thermal conductivity, resolving the thermal management issues associated with traditional mold compound.
2Reliability
If mold compound is used for chip encapsulation, then protection is provided, but outgassing occurs during high-temperature processes
Solution Approach 1:
By eliminating the mold compound entirely and using a cavity-based mechanical retention system with adhesive bonding, the patent removes the source of outgassing that occurs during high-temperature reflow processes, enabling compatibility with high-temperature manufacturing and operation.
Solution Approach 2:
The patent uses thin-film adhesive layers and cavity structures that are simpler and more thermally stable than mold compound, providing sufficient protection without the thermal degradation and outgassing issues of traditional encapsulants.
3Ease of operation
If mold compound is used for chip mounting, then chip placement is achieved, but contact difficulties occur with IC leads
Solution Approach 1:
The patent removes the mold compound that complicates contact alignment and instead uses direct cavity-based mechanical retention with adhesive bonding. The IC leads can be directly contacted through the carrier structure or via redistribution layers formed on the carrier, eliminating the interference that mold compound creates with lead contact.
4Reliability
If traditional embedded wafer level packaging is used, then chip integration is achieved, but poor thermal conductivity limits heat dissipation
Solution Approach 1:
The patent employs a composite packaging structure where the carrier is combined with high-thermal-conductivity materials such as thermal interface materials or solder materials in the chip recesses. This composite approach creates direct thermal pathways from the chip to the carrier, dramatically improving heat dissipation compared to the thermal barrier created by mold compound.
Data Source
AI summary
Various embodiments provide for a chip package including a carrier; a layer over the carrier; a further carrier material over the layer, the further carrier material comprising a foil; one or more openings in the further carrier material, wherein the one or more openings expose at least one or more portions of the layer from the further carrier material; and a chip comprising one or more contact pads, wherein the chip is adhered to the carrier via the one or more exposed portions of the layer.