Chip Package Contact Clip for Voltage Supply and Sensing

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Solution Overview

Problem

The existing chip packaging methods require additional source-sensing leads connected via wire bonds, leading to increased packaging costs and complexity due to the need for extra connecting mechanisms.

Innovation Solution

A chip package design that uses a contact clip to electrically couple the second terminal of the chip to both the voltage supply lead and the sensing terminal, eliminating the need for an additional wire bond for source sensing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If additional source-sensing leads connected via wire bonds are used, then voltage supply and sensing functionality is achieved, but packaging costs and complexity increase

Engineering Contradiction:

Improvevoltage supply and sensing functionalityVSAvoidpackaging complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the voltage supply lead and sensing lead into a single integrated lead structure that contacts the source contact region through a single wire bond. This merging eliminates the need for separate wire bonds for voltage supply and sensing, thereby reducing packaging complexity while maintaining both functionalities.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The voltage supply lead is designed to serve multiple functions: it simultaneously provides voltage supply to the source contact region and enables sensing of the source potential. This multi-functionality eliminates the need for a dedicated separate sensing lead, reducing the number of wire bonds and overall packaging complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If additional source-sensing leads connected via wire bonds are used, then voltage supply and sensing functionality is achieved, but packaging costs increase

Engineering Contradiction:

Improvevoltage supply and sensing functionalityVSAvoidpackaging cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention extracts and eliminates the redundant sensing lead from the traditional multi-lead configuration. By removing the unnecessary separate sensing lead and its associated wire bond, the design reduces material costs, assembly complexity, and overall packaging cost while retaining sensing functionality through the integrated lead.

Inventive Principle:

Principle #2Taking out (Extraction)

3Temperature

If contact area is increased for cooling, then cooling efficiency is improved, but device structure becomes more complex

Engineering Contradiction:

Improvecooling efficiencyVSAvoiddevice structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the electrical connection function and thermal management function into a single integrated lead structure. The lead that provides electrical connection also serves as a thermal path due to its extended contact area with the source contact region, eliminating the need for separate cooling structures and reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The lead structure is designed to perform multiple functions simultaneously: electrical connection for voltage supply/sensing and thermal conduction for cooling. The extended contact area of the lead with the source contact region provides both electrical contact and thermal contact, making the lead a multi-functional element that improves cooling without adding structural complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces packaging costs and complexity while improving the contact area and cooling efficiency, enhancing the performance of the electrical device by eliminating the need for additional wire bonds and allowing for improved voltage supply and sensing functionality.

Implementation Method 1

an electrically conductive element formed over the second terminal, the electrically conductive element electrically coupling the second terminal to the voltage supply lead and the sensing terminal

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8853835B2Chip arrangements, a chip package and a method for manufacturing a chip arrangement

Publication Date: 2014.10.07 INFINEON TECHNOLOGIES AG

AI summary

A chip package is provided. The chip package includes a chip carrier, a voltage supply lead, a sensing terminal and a chip disposed over the chip carrier. The chip includes a first terminal and a second terminal, wherein the first terminal electrically contacts the chip carrier. The chip package also includes an electrically conductive element formed over the second terminal, the electrically conductive element electrically coupling the second terminal to the voltage supply lead and the sensing terminal.